ICEDME 2019: International Conference on Electron Device and Mechanical Engineering
- Call for paper, ranking, acceptance rate,
submission deadline, notification date, conference location, submission guidelines, and other important details
This article provides the call for paper, ranking, acceptance rate,
submission deadline, notification date, conference location, submission guidelines, and other important details of ICEDME 2019: International Conference on Electron Device and Mechanical Engineering all at one place.
|
Conference Location
|
Suzhou, China
|
|
Conference Date
|
2019-03-29
|
|
Notification Date
|
|
|
Submission Deadline
|
2019-03-20
|
|
Conference Website and Submission Link
|
http://www.icedme.net/
|
Conference Ranking
International Conference on Electron Device and Mechanical Engineering ranking based on CCF, Core, and Qualis is shown below:
|
CCF Ranking
|
|
|
Core Ranking
|
|
|
Qualis Ranking
|
|
Click here to check the ranking of any conference.
-
About CCF Ranking: The Chinese Computing Federation (CCF) Ranking provides a ranking of peer-reviewed journals and conferences in the field of computer science.
-
About Core Ranking: The CORE Conference Ranking is a measure to assess the major conference in the computing field. This ranking is governed by the CORE Executive Committee. To know more about Core ranking, visit Core ranking portal.
-
About Qualis Ranking: This conference ranking is published by the Brazilian ministry of education. It uses the h-index as a performance metric to rank conferences. Conferences are classified into performance groups that range from A1 (to the best), A2, B1, B2,..., B5 (to the wost). To know more about qualis ranking, visit here
Conference Acceptance Rate
Below is the acceptance rate of International Conference on Electron Device and Mechanical Engineering conference for the last few years:
| Year |
Submitted Papers |
Accepted Papers |
Accepted Percentage/Acceptance Rate |
We are working hard to collect and update the acceptance rate details of the conferences for recent years. However, you can consider the above (if available) acceptance rates to predict the average chances of acceptance of your research paper at this conference.
Conference Call for paper
The 2019 2nd International Conference on Electron Device and Mechanical Engineeringļ¼ICEDME 2019ļ¼serves as good platforms for academics, researchers, and engineers to meet and exchange innovative ideas and information on all aspects of Electron Device and Mechanical Engineering. We are delighted to invite you to participate in ICEDME2019.Topics of interests are in the broad areas of Financial Innovation and Economic Development, including but not limited to:1)
Electronic and Embedded Systems2)
Modern Circuit Theory and Applications3)
DSP real-time encoding technology and signal4)
Computational Electromagnetics and Electromagnetic Simulation Technology5)
Micro-optoelectronic Device Technology6)
Embedded Systems7)
Sensor Research8)
Antenna Technology9)
RF Components10)
Circuits, devices and systems11)
Smart grid and circuit12)
Signal and multimedia processing13)
Biomedical electronics and bioinformatics14)
Communication engineering15)
Electronics and electrical engineering16)
Nano electro mechanical System17)
Photonics and optoelectronics18)
Information engineering19)
Wireless/Mobile communication and computing20)
Software specification and software assurance21)
Analysis of power quality and system stability22)
Assembly and packaging23)
Analog circuits and digital circuits24)
Antenna and propagation25)
Electric energy processing26)
Electromagnetic and photonics27)
Electro-optical phenomena of semiconductors28)
Power electronics and energy systems29)
Signal processing30)
Techniques of laser and applications Of electro-optics31)
Simulation of propagation32)
Battery management system33)
Circuits and electronics34)
Computer relaying integrated optics and electro-optics devices35)
Microwave theory and techniques36)
Microwave and millimeter37)
Modulation, coding, and channel analysis38)
Power electronics39)
Remote control and techniques of GPS40)
Robotics and atomization engineering41)
Signal integrity design for high-speed digital systems42)
Solar power generation43)
Wind power generation44)
Analog Electronic Technology45)
Digital Electronic Technology46)
Microcomputer Principle and Application47)
Signals and Systems48)
Automatic Control Principle49)
Power Electronic Technology50)
Automatic Control System51)
Electrical Control Technology52)
Microcomputer Control Technology53)
Power System Analysis54)
Electrical Machinery55)
Insulation Technology56)
High Voltage Technology57)
HVDC Transmission Technology58)
Electromagnetic and Photonics59)
Microelectronics60)
Electronic Circuits
Submission Deadline
ICEDME 2019: International Conference on Electron Device and Mechanical Engineering submission deadline is 2019-03-20.
Note: It is generally recommended to submit your conference paper
on or before the submission deadline. Generally, conferences do not
encourage to submit the research paper after the deadline is over.
In rare scenarios, conferences extend their deadline. Decision about the
extension of the deadline is generally updated on the official conference webpage.
Notification date
Notification date of ICEDME 2019: International Conference on Electron Device and Mechanical Engineering is .
Note: This is the date on which conference announces the result about acceptance or rejection of submitted papers. If your research paper is accepted, the conference will request you to submit the camera ready version of your research paper by the due date. Due date to submit the camera ready version of the paper is generally posted on the official web page of the conferences or notified to you via. email.
Conference Date
ICEDME 2019: International Conference on Electron Device and Mechanical Engineering will start on 2019-03-29.
Note: This is the date on which the conference starts.
Conference Location
ICEDME 2019: International Conference on Electron Device and Mechanical Engineering will be organized at Suzhou, China. This is the place where the conference is organized and the research paper is to be presented.
