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IEEE Transactions on Components, Packaging and Manufacturing Technology

Impact, Factor and Metrics, Impact Score, Ranking, h-index, SJR, Rating, Publisher, ISSN, and More

Last Updated on June 27, 2025

Impact Score

2024-2025

3.53

h-Index

2024-2025

 119

Rank

2024-2025

 7882

SJR

2024-2025

 0.716

Note: The impact score or impact index shown here is equivalent to the average number of times documents published in a journal/conference in the past two years have been cited in the current year (i.e., Cites / Doc. (2 years)). It is based on Scopus data and can be a little higher or different compared to the impact factor (IF) produced by Journal Citation Report. Please refer to the Web of Science data source to check the exact journal impact factor ™ (Thomson Reuters) metric.

Important Metrics and Factor

Title IEEE Transactions on Components, Packaging and Manufacturing Technology
Abbreviation IEEE Trans. Compon. Packag. Manuf. Technol.
Publication Type Journal
Subject Area, Categories, Scope Industrial and Manufacturing Engineering (Q1); Electrical and Electronic Engineering (Q2); Electronic, Optical and Magnetic Materials (Q2)
h-index 119
Overall Rank/Ranking 7882
SCImago Journal Rank (SJR) 0.716
Impact Score 3.53
Publisher Institute of Electrical and Electronics Engineers Inc.
Country United States
ISSN 21563950
Best Quartile Q1
Coverage History 2011-2025




About IEEE Transactions on Components, Packaging and Manufacturing Technology


IEEE Transactions on Components, Packaging and Manufacturing Technology is a journal covering the technologies/fields/categories related to Industrial and Manufacturing Engineering (Q1); Electrical and Electronic Engineering (Q2); Electronic, Optical and Magnetic Materials (Q2). It is published by Institute of Electrical and Electronics Engineers Inc.. The overall rank of IEEE Transactions on Components, Packaging and Manufacturing Technology is 7882. According to SCImago Journal Rank (SJR), this journal is ranked 0.716. SCImago Journal Rank is an indicator, which measures the scientific influence of journals. It considers the number of citations received by a journal and the importance of the journals from where these citations come. SJR acts as an alternative to the Journal Impact Factor (or an average number of citations received in last 2 years). This journal has an h-index of 119. The best quartile for this journal is Q1.

The ISSN of IEEE Transactions on Components, Packaging and Manufacturing Technology journal is 21563950. An International Standard Serial Number (ISSN) is a unique code of 8 digits. It is used for the recognition of journals, newspapers, periodicals, and magazines in all kind of forms, be it print-media or electronic. IEEE Transactions on Components, Packaging and Manufacturing Technology is cited by a total of 2441 articles during the last 3 years (Preceding 2024).


IEEE Transactions on Components, Packaging and Manufacturing Technology Impact IF 2024-2025


The Impact IF 2024 of IEEE Transactions on Components, Packaging and Manufacturing Technology is 3.53, which is computed in 2025 as per its definition. IEEE Transactions on Components, Packaging and Manufacturing Technology IF is increased by a factor of 0.87 and approximate percentage change is 32.71% when compared to preceding year 2023, which shows a rising trend. The impact IF, also denoted as Journal impact score (JIS), of an academic journal is a measure of the yearly average number of citations to recent articles published in that journal. It is based on Scopus data.

Table Setting

IEEE Transactions on Components, Packaging and Manufacturing Technology Impact IF 2025 Prediction


Impact IF 2024 of IEEE Transactions on Components, Packaging and Manufacturing Technology is 3.53. If the same upward trend persists, Impact IF may rise in 2025 as well.


Impact IF Trend


Year wise Impact IF of IEEE Transactions on Components, Packaging and Manufacturing Technology. Based on Scopus data.


Year Impact IF
2025/2026 Coming Soon
2024 3.53
2023 2.66
2022 2.52
2021 2.26
2020 2.12
2019 2.50
2018 2.44
2017 2.08
2016 1.94
2015 1.83
2014 1.98

IEEE Transactions on Components, Packaging and Manufacturing Technology h-index


  Table Setting

IEEE Transactions on Components, Packaging and Manufacturing Technology has an h-index of 119. It means 119 articles of this journal have more than 119 number of citations. The h-index is a way of measuring the productivity and citation impact of the publications. The h-index is defined as the maximum value of h such that the given journal/author has published h papers that have each been cited at least h number of times.




IEEE Transactions on Components, Packaging and Manufacturing Technology ISSN


The ISSN of IEEE Transactions on Components, Packaging and Manufacturing Technology is 21563950. ISSN stands for International Standard Serial Number.

An ISSN is a unique code of 8 digits. It is used for the recognition of journals, newspapers, periodicals, and magazines in all kind of forms, be it print-media or electronic.

Table Setting

IEEE Transactions on Components, Packaging and Manufacturing Technology Rank and SCImago Journal Rank (SJR)


The overall rank of IEEE Transactions on Components, Packaging and Manufacturing Technology is 7882. According to SCImago Journal Rank (SJR), this journal is ranked 0.716. SCImago Journal Rank is an indicator, which measures the scientific influence of journals. It considers the number of citations received by a journal and the importance of the journals from where these citations come.

SJR of IEEE Transactions on Components, Packaging and Manufacturing Technology by Year


Year SJR
2025/2026 Coming Soon
2024 0.716
2023 0.562
2022 0.615
2021 0.623
2020 0.496
2019 0.632
2018 0.552
2017 0.482
2016 0.511
2015 0.499
2014 0.568

Ranking of IEEE Transactions on Components, Packaging and Manufacturing Technology by Year


Year Ranking
2025/2026 Coming Soon
2024 7882
2023 9617
2022 8327
2021 7907
2020 10144
2019 7792
2018 8708
2017 9491
2016 9114
2015 9221
2014 8066

IEEE Transactions on Components, Packaging and Manufacturing Technology Publisher


Table Setting

IEEE Transactions on Components, Packaging and Manufacturing Technology is published by Institute of Electrical and Electronics Engineers Inc.. It's publishing house is located in United States. Coverage history of this journal is as following: 2011-2025. The organization or individual who handles the printing and distribution of printed or digital publications is known as Publisher.


Call For Papers


Visit the official website of the journal/conference to check the further details about the call for papers.


Abbreviation


The IS0 4 standard abbreviation of IEEE Transactions on Components, Packaging and Manufacturing Technology is IEEE Trans. Compon. Packag. Manuf. Technol.. This abbreviation ('IEEE Trans. Compon. Packag. Manuf. Technol.') is well recommended and approved for the purpose of indexing, abstraction, referencing and citing goals. It meets all the essential criteria of ISO 4 standard.

ISO 4 (International Organization for Standardization 4) is an international standard that defines a uniform and consistent system for abbreviating serial publication titles and journals.


How to publish in IEEE Transactions on Components, Packaging and Manufacturing Technology


If your research field is/are related to Industrial and Manufacturing Engineering (Q1); Electrical and Electronic Engineering (Q2); Electronic, Optical and Magnetic Materials (Q2), then please visit the official website of this journal.


Acceptance Rate


The acceptance rate/percentage of any academic journal/conference depends upon many parameters. Some of the critical parameters are listed below.

  • The demand or interest of researchers/scientists in publishing in a specific Journal/Conference.
  • Peer review complexity and timeline.
  • The mix of unsolicited and invited submissions.
  • The time it takes from manuscript submission to final publication.
  • And Many More.

It is essential to understand that the acceptance rate/rejection rate of papers varies among journals. Some Journals considers all the manuscripts submissions as a basis of acceptance rate computation. On the other hand, few consider the only manuscripts sent for peer review or few even not bother about the accurate maintenance of total submissions. Hence, it can provide a rough estimation only.

The best way to find out the acceptance rate is to reach out to the associated editor or to check the official website of the Journal/Conference.



Frequently Asked Questions (FAQs)


What's the latest impact IF of the IEEE Transactions on Components, Packaging and Manufacturing Technology?

IEEE Transactions on Components, Packaging and Manufacturing Technology latest impact IF is 3.53. It's evaluated in the year 2024. The highest and the lowest impact IF or impact score of this journal are 3.53 (2024) and 1.83 (2015), respectively, in the last 11 years. Moreover, its average IS is 2.35 in the previous 11 years.


What's the SCImago Journal Rank (SJR) of the IEEE Transactions on Components, Packaging and Manufacturing Technology?

The IEEE Transactions on Components, Packaging and Manufacturing Technology has an SJR (SCImago Journal Rank) of 0.716, according to the latest data. It is computed in the year 2025. In the past 11 years, this journal has recorded a range of SJR, with the highest being 0.716 in 2024 and the lowest being 0.482 in 2017. Furthermore, the average SJR of the IEEE Transactions on Components, Packaging and Manufacturing Technology over the previous 11-year period stands at 2.35.


What's the latest h-index of the IEEE Transactions on Components, Packaging and Manufacturing Technology?

The latest h-index of the IEEE Transactions on Components, Packaging and Manufacturing Technology is 119.


Who's the publisher of the IEEE Transactions on Components, Packaging and Manufacturing Technology?

The IEEE Transactions on Components, Packaging and Manufacturing Technology is published by the Institute of Electrical and Electronics Engineers Inc., with its country of publication being the United States.


What's the current ranking of the IEEE Transactions on Components, Packaging and Manufacturing Technology?

The IEEE Transactions on Components, Packaging and Manufacturing Technology is currently ranked 7882 out of 27955 Journals, Conferences, and Book Series in the latest ranking. Over the course of the last 11 years, this journal has experienced varying rankings, reaching its highest position of 7792 in 2019 and its lowest position of 10144 in 2020.


What's the abbreviation or short name for the IEEE Transactions on Components, Packaging and Manufacturing Technology?

The standard ISO4 abbreviation for the IEEE Transactions on Components, Packaging and Manufacturing Technology is IEEE Trans. Compon. Packag. Manuf. Technol..


Is the "IEEE Transactions on Components, Packaging and Manufacturing Technology" classified as a Journal, Conference and Proceedings, Trade Journal or Book Series?

IEEE Transactions on Components, Packaging and Manufacturing Technology is classified as a journal that the Institute of Electrical and Electronics Engineers Inc. publishes.


What's the scope or major areas of the IEEE Transactions on Components, Packaging and Manufacturing Technology?

The IEEE Transactions on Components, Packaging and Manufacturing Technology encompasses the following areas:

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

For a more comprehensive understanding of its scope, check the official website of this journal.


What's the ISSN of the IEEE Transactions on Components, Packaging and Manufacturing Technology?

The IEEE Transactions on Components, Packaging and Manufacturing Technology is assigned the following International Standard Serial Numbers (ISSN): 21563950.


What's the best quartile of the IEEE Transactions on Components, Packaging and Manufacturing Technology?

The best quartile for the IEEE Transactions on Components, Packaging and Manufacturing Technology is Q1 (2024).


What's the coverage history of the IEEE Transactions on Components, Packaging and Manufacturing Technology?

The IEEE Transactions on Components, Packaging and Manufacturing Technology coverage history can be summarized as follows: 2011-2025.


Credits and Sources


  • Scimago Journal & Country Rank (SJR), https://www.scimagojr.com/
  • Journal Impact Factor, https://clarivate.com/



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Year wise Impact Score (IS) of IEEE Transactions on Components, Packaging and Manufacturing Technology

Impact Score Table

Year Impact Score (IS)
2025/2026 Coming Soon
2024 3.53
2023 2.66
2022 2.52
2021 2.26
2020 2.12
2019 2.50
2018 2.44
2017 2.08
2016 1.94
2015 1.83
2014 1.98



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