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Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials- Impact Score, Overall Ranking, h-index, SJR, Rating, Publisher, ISSN, and Other Important Metrics

Last Updated on May 27, 2022

Impact Score

0.00

h-Index

 25

Rank

 18694

SJR

 0.197

Note: The impact score shown here is equivalent to the average number of times documents published in a journal/conference in the past two years have been cited in the current year (i.e., Cites / Doc. (2 years)). It is based on Scopus data and can be a little higher or different compared to the impact factor (IF) produced by Journal Citation Report. Please refer to the Web of Science data source to check the exact journal impact factor ™ (Thomson Reuters) metric.

Important Metrics

Title Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials
Abbreviation Proc. IEEE Int. Conf. Prop. Appl. Dielectr. Mater.
Publication Type Conference and proceedings
Subject Area, Categories, Scope Condensed Matter Physics; Electronic, Optical and Magnetic Materials; Materials Chemistry
h-index 25
Overall Rank/Ranking 18694
SCImago Journal Rank (SJR) 0.197
Impact Score 0.00
Publisher Institute of Electrical and Electronics Engineers Inc.
Country United States
ISSN -




About Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials


Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials is a conference and proceedings covering the technologies/fields/categories related to Condensed Matter Physics; Electronic, Optical and Magnetic Materials; Materials Chemistry. It is published by Institute of Electrical and Electronics Engineers Inc.. The overall rank of Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials is 18694. According to SCImago Journal Rank (SJR), this conference and proceedings is ranked 0.197. SCImago Journal Rank is an indicator, which measures the scientific influence of journals. It considers the number of citations received by a journal and the importance of the journals from where these citations come. SJR acts as an alternative to the Journal Impact Factor (or an average number of citations received in last 2 years). This conference and proceedings has an h-index of 25. The best quartile for this conference and proceedings is -.

The ISSN of Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials conference and proceedings is -. An International Standard Serial Number (ISSN) is a unique code of 8 digits. It is used for the recognition of journals, newspapers, periodicals, and magazines in all kind of forms, be it print-media or electronic. Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials is cited by a total of 133 articles during the last 3 years (Preceding 2021).


Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials Impact Score 2021-2022


The impact score (IS) 2021 of Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials is 0.00, which is computed in 2022 as per its definition. The impact score (IS), also denoted as Journal impact score (JIS), of an academic journal is a measure of the yearly average number of citations to recent articles published in that journal. It is based on Scopus data.

Table Setting


Impact Score Trend


Year wise Impact Score (IS) of Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials. Based on Scopus data.


Year Impact Score (IS)
2022/2023 Coming Soon
2021 0.00
2020 0.59
2019 0.48
2018 0.00
2017 0.50
2016 0.55
2015 0.00
2014 0.28

Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials h-index


  Table Setting

Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials has an h-index of 25. It means 25 articles of this conference and proceedings have more than 25 number of citations. The h-index is a way of measuring the productivity and citation impact of the publications. The h-index is defined as the maximum value of h such that the given journal/author has published h papers that have each been cited at least h number of times.




Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials ISSN


The ISSN of Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials is -. ISSN stands for International Standard Serial Number.

An ISSN is a unique code of 8 digits. It is used for the recognition of journals, newspapers, periodicals, and magazines in all kind of forms, be it print-media or electronic.

Table Setting

Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials Rank and SCImago Journal Rank (SJR)


The overall rank of Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials is 18694. According to SCImago Journal Rank (SJR), this conference and proceedings is ranked 0.197. SCImago Journal Rank is an indicator, which measures the scientific influence of journals. It considers the number of citations received by a journal and the importance of the journals from where these citations come.


Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials Publisher


Table Setting

Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials is published by Institute of Electrical and Electronics Engineers Inc.. It's publishing house is located in United States. Coverage history of this conference and proceedings is as following: 1994, 1997, 2000, 2003, 2006-2007, 2009, 2012, 2015, 2018, 2021. The organization or individual who handles the printing and distribution of printed or digital publications is known as Publisher.


Call For Papers


Visit the official website of the journal/conference to check the further details about the call for papers.


Abbreviation


The IS0 4 standard abbreviation of Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials is Proc. IEEE Int. Conf. Prop. Appl. Dielectr. Mater.. This abbreviation ('Proc. IEEE Int. Conf. Prop. Appl. Dielectr. Mater.') is well recommended and approved for the purpose of indexing, abstraction, referencing and citing goals. It meets all the essential criteria of ISO 4 standard.

ISO 4 (International Organization for Standardization 4) is an international standard that defines a uniform and consistent system for abbreviating serial publication titles and journals.


How to publish in Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials


If your research field is/are related to Condensed Matter Physics; Electronic, Optical and Magnetic Materials; Materials Chemistry, then please visit the official website of this conference and proceedings.


Acceptance Rate


The acceptance rate/percentage of any academic journal/conference depends upon many parameters. Some of the critical parameters are listed below.

  • The demand or interest of researchers/scientists in publishing in a specific Journal/Conference.
  • Peer review complexity and timeline.
  • The mix of unsolicited and invited submissions.
  • The time it takes from manuscript submission to final publication.
  • And Many More.

It is essential to understand that the acceptance rate/rejection rate of papers varies among journals. Some Journals considers all the manuscripts submissions as a basis of acceptance rate computation. On the other hand, few consider the only manuscripts sent for peer review or few even not bother about the accurate maintenance of total submissions. Hence, it can provide a rough estimation only.

The best way to find out the acceptance rate is to reach out to the associated editor or to check the official website of the Journal/Conference.


Credits and Sources


  • Scimago Journal & Country Rank (SJR), https://www.scimagojr.com/
  • Journal Impact Factor, https://clarivate.com/



Impact Score, h-Index, and Other Important Details of These Journals, Conferences, and Books


Journal/Conference/Workshop/Book Title Type Ranking Publisher h-index Impact Score
Journal of the Institute of Mathematics of Jussieu journal 3608 Cambridge University Press 32 0.81
Journal of Medicine and Philosophy journal 13743 Oxford University Press 53 1.41
Journal of Postgraduate Medical Institute journal 24167 Postgraduate Medical Institute 12 0.13
Journal of Law and Society journal 14544 Wiley-Blackwell Publishing Ltd 50 1.03
Kardiotechnik journal 26141 Deutsche Gesellschaft fur Kardiotechnik e.V. 6 0.04
Journal of Renewable Materials journal 12461 Tech Science Press 23 2.04
Radiologia Brasileira journal 10523 Colegio Brasileiro de Radiologia 20 1.47
Journal of Dental Sciences journal 9739 Association for Dental Sciences of the Republic of China 24 2.59
Communio Viatorum journal 25907 Thomson Reuters 3 0.03
Journal of Language Aggression and Conflict journal 7612 John Benjamins Publishing Company 13 2.00

Check complete list




Year wise Impact Score (IS) of Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials

Impact Score Table

Year Impact Score (IS)
2022/2023 Coming Soon
2021 0.00
2020 0.59
2019 0.48
2018 0.00
2017 0.50
2016 0.55
2015 0.00
2014 0.28



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