Title | Digest of Technical Papers - IEEE International Solid-State Circuits Conference |
Abbreviation | Dig. Tech. Pap. - IEEE Int. Solid-State Circuits Conf. |
Publication Type | Conference and proceedings |
Subject Area, Categories, Scope | Electrical and Electronic Engineering; Electronic, Optical and Magnetic Materials |
h-index | 106 |
Overall Rank/Ranking | 288 |
SCImago Journal Rank (SJR) | 4.793 |
Impact Score | 6.14 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Country | United States |
ISSN | 1936530 |
Digest of Technical Papers - IEEE International Solid-State Circuits Conference is a conference and proceedings covering the technologies/fields/categories related to Electrical and Electronic Engineering; Electronic, Optical and Magnetic Materials. It is published by Institute of Electrical and Electronics Engineers Inc.. The overall rank of Digest of Technical Papers - IEEE International Solid-State Circuits Conference is 288. According to SCImago Journal Rank (SJR), this conference and proceedings is ranked 4.793. SCImago Journal Rank is an indicator, which measures the scientific influence of journals. It considers the number of citations received by a journal and the importance of the journals from where these citations come. SJR acts as an alternative to the Journal Impact Factor (or an average number of citations received in last 2 years). This conference and proceedings has an h-index of 106. The best quartile for this conference and proceedings is -.
The ISSN of Digest of Technical Papers - IEEE International Solid-State Circuits Conference conference and proceedings is 1936530. An International Standard Serial Number (ISSN) is a unique code of 8 digits. It is used for the recognition of journals, newspapers, periodicals, and magazines in all kind of forms, be it print-media or electronic. Digest of Technical Papers - IEEE International Solid-State Circuits Conference is cited by a total of 3983 articles during the last 3 years (Preceding 2021).
The impact score (IS) 2021 of Digest of Technical Papers - IEEE International Solid-State Circuits Conference is 6.14, which is computed in 2022 as per its definition. The impact score (IS), also denoted as Journal impact score (JIS), of an academic journal is a measure of the yearly average number of citations to recent articles published in that journal. It is based on Scopus data.
Year | Impact Score (IS) |
---|---|
2022/2023 | Coming Soon |
2021 | 6.14 |
2020 | 5.88 |
2019 | 7.23 |
2018 | 6.22 |
2017 | 5.35 |
2016 | 5.59 |
2015 | 5.53 |
2014 | 4.74 |
Digest of Technical Papers - IEEE International Solid-State Circuits Conference has an h-index of 106. It means 106 articles of this conference and proceedings have more than 106 number of citations. The h-index is a way of measuring the productivity and citation impact of the publications. The h-index is defined as the maximum value of h such that the given journal/author has published h papers that have each been cited at least h number of times.
The ISSN of Digest of Technical Papers - IEEE International Solid-State Circuits Conference is 1936530. ISSN stands for International Standard Serial Number.
An ISSN is a unique code of 8 digits. It is used for the recognition of journals, newspapers, periodicals, and magazines in all kind of forms, be it print-media or electronic.
The overall rank of Digest of Technical Papers - IEEE International Solid-State Circuits Conference is 288. According to SCImago Journal Rank (SJR), this conference and proceedings is ranked 4.793. SCImago Journal Rank is an indicator, which measures the scientific influence of journals. It considers the number of citations received by a journal and the importance of the journals from where these citations come.
Digest of Technical Papers - IEEE International Solid-State Circuits Conference is published by Institute of Electrical and Electronics Engineers Inc.. It's publishing house is located in United States. Coverage history of this conference and proceedings is as following: 1958-1964, 1966-1968, 1972-1973, 1975-1990, 1992-1998, 2000-2021. The organization or individual who handles the printing and distribution of printed or digital publications is known as Publisher.
Visit the official website of the journal/conference to check the further details about the call for papers.
The IS0 4 standard abbreviation of Digest of Technical Papers - IEEE International Solid-State Circuits Conference is Dig. Tech. Pap. - IEEE Int. Solid-State Circuits Conf.. This abbreviation ('Dig. Tech. Pap. - IEEE Int. Solid-State Circuits Conf.') is well recommended and approved for the purpose of indexing, abstraction, referencing and citing goals. It meets all the essential criteria of ISO 4 standard.
ISO 4 (International Organization for Standardization 4) is an international standard that defines a uniform and consistent system for abbreviating serial publication titles and journals.
If your research field is/are related to Electrical and Electronic Engineering; Electronic, Optical and Magnetic Materials, then please visit the official website of this conference and proceedings.
The acceptance rate/percentage of any academic journal/conference depends upon many parameters. Some of the critical parameters are listed below.
It is essential to understand that the acceptance rate/rejection rate of papers varies among journals. Some Journals considers all the manuscripts submissions as a basis of acceptance rate computation. On the other hand, few consider the only manuscripts sent for peer review or few even not bother about the accurate maintenance of total submissions. Hence, it can provide a rough estimation only.
The best way to find out the acceptance rate is to reach out to the associated editor or to check the official website of the Journal/Conference.
Journal/Conference/Workshop/Book Title | Type | Ranking | Publisher | h-index | Impact Score |
---|---|---|---|---|---|
Geocarrefour | journal | 23215 | 3 | 0.14 | |
Natura Croatica | journal | 11650 | Croatian Natural History Museum | 20 | 0.74 |
Ecological Monographs | journal | 446 | Wiley-Blackwell | 161 | 9.59 |
Journal of Japan Institute of Electronics Packaging | journal | 24162 | The Japan Institute of Electronics Packaging | 11 | 0.06 |
Stochastics | journal | 10060 | Gordon and Breach Science Publishers | 25 | 0.99 |
Forum Italicum | journal | 26624 | SAGE Publications Inc. | 5 | 0.03 |
Veterinary Parasitology | journal | 6127 | Elsevier | 131 | 2.85 |
Acarologia | journal | 6602 | Les Amis d'Acarologia | 24 | 1.35 |
Organometallic Chemistry | book series | 9692 | Royal Society of Chemistry | 13 | 1.83 |
Naturschutz und Landschaftsplanung | journal | 23144 | Verlag Eugen Ulmer | 14 | 0.07 |
Year | Impact Score (IS) |
---|---|
2022/2023 | Coming Soon |
2021 | 6.14 |
2020 | 5.88 |
2019 | 7.23 |
2018 | 6.22 |
2017 | 5.35 |
2016 | 5.59 |
2015 | 5.53 |
2014 | 4.74 |