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IOP ICMMM 2020 : 7th International Conference on Mechanical, Materials and Manufacturing - EI Compendex, Scopus

Washington, USA
Event Date: Sep 25, 2020 - Sep 27, 2020
Submission Deadline: May 15, 2020
Notification of Acceptance: Jun 05, 2020

About

On behalf of the Organizing Committees of 2020 7th International Conference on Mechanical, Materials and Manufacturing (ICMMM 2020), we cordially invite you to participate in this event to be held in Washington, USA from September 25-27, 2020, co-sponsored by Capitol Technology University, USA, with its workshop TMAE 2020. ICMMM aims to provide a platform for scholars, engineers, and scientists to present robust research demonstrating the expanding frontiers in the fields of Mechanical, Materials and Manufacturing. The past six events were held in Chengdu (China, 2014), Paris (France, 2015), Savannah (USA, 2016), Atlanta (USA, 2017), Orlando (USA, 2018), Boston (USA, 2019) successively.

Special gratitude would be extended to all keynotes speakers and TPC members for their technical advices, and to all the scholars and experts in this field for eager supports.

For the 7th conference in Washington, the Organizing Committees expects and firmly believes that attendees from all over the world would be harvested academically and enjoy USA customs and practices.

Call For Paper

The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. Topics of interest for submission include, but are not limited to:

MATERIAL SCIENCE AND ENGINEERING:

  • Composite Materials
  • Materials Physics and Chemistry
  • New Energy Materials
  • Surface Engineering/Coatings
  • Microwave Processing of Materials
  • Laser Processing Technology
  • Material Design of Computer Aided

MECHANICAL AND MANUFACTURING ENGINEERING

  • Energy Conversion System
  • Industrial Tribology
  • Optimization of Systems
  • Mechanical and Materials Engineering
  • Aerospace Systems and Technology
  • Instrumentation and Control
  • Tribology and Reverse Engineering

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