NexMat Summit 2024 : NexGen Materials Engineering and Applications Summit Tokyo, Japan
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| Event Date: | September 23, 2024 - September 25, 2024 |
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| Abstract Submission Deadline: | February 19, 2024 |
| Submission Deadline: | June 30, 2024 |
| Notification of Acceptance: | August 15, 2024 |
| Camera Ready Version Due: | August 31, 2024 |
Call for Papers |
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Call for Papers: NexMat Summit 24
About NexMat Summit 24: Join us at NexMat Summit 24, a leading international conference on materials engineering. Submit your original research in areas such as Advanced Materials, Nanotechnology, Biomaterials, and more. Important Dates: Submission Deadline: June 30, 2024 Acceptance Notification: August 15, 2024 Camera-Ready Deadline: August 31, 2024 NexMat Summit 24 Dates: September 23-25, 2024 Submission Guidelines: Follow [https://www.materialsscience.theiconicmeetings.com/presentationguidelines] for paper submissions. Selected papers may be published in associated journals. Contact: For inquiries, contact Conference Manager at [email protected]. Visit [https://www.materialsscience.theiconicmeetings.com/] for details. |
Summary |
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NexMat Summit 2024 : NexGen Materials Engineering and Applications Summit will take place in Tokyo, Japan. It’s a 3 days event starting on Sep 23, 2024 (Monday) and will be winded up on Sep 25, 2024 (Wednesday). NexMat Summit 2024 falls under the following areas: MATERIALS SCIENCE, NANOTECHNOLOGY, BIOTECHNOLOGY, RENEWABLE ENERGY, etc. Submissions for this Summit can be made by Jun 30, 2024. Authors can expect the result of submission by Aug 15, 2024. Upon acceptance, authors should submit the final version of the manuscript on or before Aug 31, 2024 to the official website of the Summit. Please check the official event website for possible changes before you make any travelling arrangements. Generally, events are strict with their deadlines. It is advisable to check the official website for all the deadlines. Other Details of the NexMat Summit 2024
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Credits and Sources |
| [1] NexMat Summit 2024 : NexGen Materials Engineering and Applications Summit |
