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AIBlock 2019 : 1st International Workshop on Application Intelligence and Blockchain Security (AIBlock)

Bogota, Colombia
Event Date: Jun 5, 2019 - Jun 7, 2019
Submission Deadline: Apr 8, 2019
Notification of Acceptance: May 8, 2019
Camera Ready Version Due : May 15, 2019

Call For Paper

1st International Workshop on Application Intelligence and Blockchain Security (AIBlock)

In Conjunction With ACNS 2019, Bogotá, Colombia

Special Issue:
A special issue for the best papers selected from each workshop will be published in IJIS, Springer (, IF = 1.658).

Call For Papers:

As applications are one of the most critical assets, application security aims to take proper actions to improve the security of an application by identifying and fixing application vulnerabilities. Application intelligence plays an important role in designing an appropriate security mechanism; thus application intelligence security gains increasing attention. With the adoption of blockchain technology, how to benefit security by combining blockchains with application intelligence become an emerging research topic.

This workshop attempts to provide a platform for professionals from academia and industry to discuss challenges and potential solutions in this direction. We seek submissions describing either theoretical or practical solutions in relation to application intelligence security and blockchain security. Topics of interest include, but are not limited to:

- Authentication
- Blockchain Platforms
- Blockchain-based Applications
- Cryptocurrency Analysis
- Data and System Integrity
- Data Protection
- Database Security
- Decentralized Application Development
- Formal Method
- Intrusion Detection
- Smart Contracts
- Trust and Privacy of Applications
- Vulnerability Analysis

Important Dates:

- Workshop paper submission deadline: Mar 30, 2019
- Workshop paper notification: Apr 30, 2019
- Camera-ready papers for pre-proceedings: May 15, 2019
- Workshop dates: Jun 5-7, 2019 (in parallel with the main conference)

Submission Guidelines:

Submissions must not substantially duplicate work that any of the authors has published elsewhere or has submitted in parallel to any other venue with formally published proceedings. Information about submissions may be shared with program chairs of other conferences for that purpose. Submissions must be anonymous, with no author names, affiliations, acknowledgement or obvious references.

Each submission must begin with a title, short abstract, and a list of keywords. The introduction should summarise the contributions of the paper at a level appropriate for a non-specialist reader. All submissions must follow the original LNCS format (see with a page limit of 18 pages (incl. references) for the main part (reviewers are not required to read beyond this limit) and 30 pages in total. Authors of accepted papers must guarantee that their paper will be presented at the conference and must make a full version of their paper available online. There will be a best paper award.

To make a submission via EasyChair System.

If there is any question, please contact us at:

Important Dates:

- Workshop paper submission deadline: April 8, 2019
- Workshop paper notification: May 8, 2019
- Camera-ready papers for pre-proceedings: May 15, 2019
- Workshop dates: Jun 5-7, 2019 (in parallel with the main conference)

Program Co-Chairs
- Weizhi Meng, Technical University of Denmark, Denmark
- Zhiqiang Liu, Shanghai Jiao Tong University, China
- Chunhua Su, University of Aizu, Japan

Technical Program Committee
Ashiq Anjum, University of Derby, UK
Man Ho Au, The Hong Kong Polytechnic University, Hong Kong
Raja Naeem Akram, Royal Holloway, University of London, UK
David Chadwick, University of Kent, UK
Taolue Chen, Oxford University, UK
Zekeriya Erkin, Delft University of Technology, Netherlands
Dieter Gollmann, Hamburg University of Technology, Germany
Debiao He, Wuhan University, China
Georgios Kambourakis, University of the Aegean, Greece
Hyoungshick Kim, Sungkyunkwan University, South Korea
Hiroaki Kikuchi, Meiji University, Japan
Peter Lewis, Aston University, UK
Jiqiang Lu, Beihang University, China
Xiapu Luo, The Hong Kong Polytechnic University, Hong Kong
Felix Gomez Marmol, University of Murcia, Span
Petr Novotny, IBM, USA
Jun Shao, Zhejiang Gongshang University, China
Seungwon Shin, KAIST, South Korea
Paolo Tasca, University College London, UK
Andreas Veneris, University of Toronto, Canada
Qianhong Wu, Beihang University, China

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