Title | IEEE Region 10 Annual International Conference, Proceedings/TENCON |
Abbreviation | IEEE Reg. 10 Annu. Int. Conf. Proc./TENCON |
Publication Type | Conference and proceedings |
Subject Area, Categories, Scope | Computer Science Applications; Electrical and Electronic Engineering |
h-index | 38 |
Overall Rank/Ranking | 20831 |
SCImago Journal Rank (SJR) | 0.178 |
Impact Score | 0.57 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Country | United States |
ISSN | 21593450, 21593442 |
IEEE Region 10 Annual International Conference, Proceedings/TENCON is a conference and proceedings covering the technologies/fields/categories related to Computer Science Applications; Electrical and Electronic Engineering. It is published by Institute of Electrical and Electronics Engineers Inc.. The overall rank of IEEE Region 10 Annual International Conference, Proceedings/TENCON is 20831. According to SCImago Journal Rank (SJR), this conference and proceedings is ranked 0.178. SCImago Journal Rank is an indicator, which measures the scientific influence of journals. It considers the number of citations received by a journal and the importance of the journals from where these citations come. SJR acts as an alternative to the Journal Impact Factor (or an average number of citations received in last 2 years). This conference and proceedings has an h-index of 38. The best quartile for this conference and proceedings is -.
The ISSN of IEEE Region 10 Annual International Conference, Proceedings/TENCON conference and proceedings is 21593450, 21593442. An International Standard Serial Number (ISSN) is a unique code of 8 digits. It is used for the recognition of journals, newspapers, periodicals, and magazines in all kind of forms, be it print-media or electronic. IEEE Region 10 Annual International Conference, Proceedings/TENCON is cited by a total of 1634 articles during the last 3 years (Preceding 2020).
The impact score (IS) 2020 of IEEE Region 10 Annual International Conference, Proceedings/TENCON is 0.57, which is computed in 2021 as per its definition. The impact score (IS), also denoted as Journal impact score (JIS), of an academic journal is a measure of the yearly average number of citations to recent articles published in that journal. It is based on Scopus data.
Year | Impact Score (IS) |
---|---|
2021/2022 | Coming Soon |
2020 | 0.57 |
2019 | 0.90 |
2018 | 0.44 |
2017 | 0.29 |
2016 | 0.05 |
2015 | 0.25 |
2014 | 0.21 |
IEEE Region 10 Annual International Conference, Proceedings/TENCON has an h-index of 38. It means 38 articles of this conference and proceedings have more than 38 number of citations. The h-index is a way of measuring the productivity and citation impact of the publications. The h-index is defined as the maximum value of h such that the given journal/author has published h papers that have each been cited at least h number of times.
The ISSN of IEEE Region 10 Annual International Conference, Proceedings/TENCON is 21593450, 21593442. ISSN stands for International Standard Serial Number.
An ISSN is a unique code of 8 digits. It is used for the recognition of journals, newspapers, periodicals, and magazines in all kind of forms, be it print-media or electronic.
The overall rank of IEEE Region 10 Annual International Conference, Proceedings/TENCON is 20831. According to SCImago Journal Rank (SJR), this conference and proceedings is ranked 0.178. SCImago Journal Rank is an indicator, which measures the scientific influence of journals. It considers the number of citations received by a journal and the importance of the journals from where these citations come.
IEEE Region 10 Annual International Conference, Proceedings/TENCON is published by Institute of Electrical and Electronics Engineers Inc.. It's publishing house is located in United States. Coverage history of this conference and proceedings is as following: 1991-1993, 1995-1997, 1999-2000, 2002-2013, 2015-2019. The organization or individual who handles the printing and distribution of printed or digital publications is known as Publisher.
Visit the official website of the journal/conference to check the further details about the call for papers.
The IS0 4 standard abbreviation of IEEE Region 10 Annual International Conference, Proceedings/TENCON is IEEE Reg. 10 Annu. Int. Conf. Proc./TENCON. This abbreviation ('IEEE Reg. 10 Annu. Int. Conf. Proc./TENCON') is well recommended and approved for the purpose of indexing, abstraction, referencing and citing goals. It meets all the essential criteria of ISO 4 standard.
ISO 4 (International Organization for Standardization 4) is an international standard that defines a uniform and consistent system for abbreviating serial publication titles and journals.
If your research field is/are related to Computer Science Applications; Electrical and Electronic Engineering, then please visit the official website of this conference and proceedings.
The acceptance rate/percentage of any academic journal/conference depends upon many parameters. Some of the critical parameters are listed below.
It is essential to understand that the acceptance rate/rejection rate of papers varies among journals. Some Journals considers all the manuscripts submissions as a basis of acceptance rate computation. On the other hand, few consider the only manuscripts sent for peer review or few even not bother about the accurate maintenance of total submissions. Hence, it can provide a rough estimation only.
The best way to find out the acceptance rate is to reach out to the associated editor or to check the official website of the Journal/Conference.
Journal/Conference/Workshop/Book Title | Type | Ranking | Publisher | h-index | Impact Score |
---|---|---|---|---|---|
Journal of the Peripheral Nervous System | journal | 4382 | Wiley-Blackwell Publishing Ltd | 67 | 2.54 |
Lecture Notes in Control and Information Sciences | book series | 21216 | Springer Verlag | 49 | 0.27 |
Journal of the European Mathematical Society | journal | 485 | European Mathematical Society Publishing House | 64 | 4.13 |
Metal Casting Design and Purchasing | trade journal | 32316 | American Foundry Society | 2 | 0.02 |
Brill's Japanese Studies Library | book series | 28962 | Brill Academic Publishers | 2 | 0.03 |
Proceedings of the 2016 IEEE ANDESCON, ANDESCON 2016 | conference and proceedings | 24944 | 6 | 0.00 | |
Australasian Conference on Robotics and Automation, ACRA | conference and proceedings | 22484 | 16 | 0.37 | |
IFIP International Conference on Wireless and Optical Communications Networks, WOCN | conference and proceedings | 26599 | 12 | 0.40 | |
Journal of Applied Mechanics, Transactions ASME | journal | 7235 | The American Society of Mechanical Engineers(ASME) | 97 | 2.12 |
AoB PLANTS | journal | 4391 | Oxford University Press | 39 | 2.85 |
Year | Impact Score (IS) |
---|---|
2021/2022 | Coming Soon |
2020 | 0.57 |
2019 | 0.90 |
2018 | 0.44 |
2017 | 0.29 |
2016 | 0.05 |
2015 | 0.25 |
2014 | 0.21 |