IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings

Impact, Factor and Metrics, Impact Score, Ranking, h-index, SJR, Rating, Publisher, ISSN, and More

About IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings

IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings is a conference and proceedings covering the technologies/fields/categories related to Artificial Intelligence; Control and Optimization; Electrical and Electronic Engineering; Electronic, Optical and Magnetic Materials; Instrumentation; Safety, Risk, Reliability and Quality. It is published by Institute of Electrical and Electronics Engineers Inc.. The overall rank of IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings is 26611. According to SCImago Journal Rank (SJR), this conference and proceedings is ranked 0.127. SCImago Journal Rank is an indicator, which measures the scientific influence of journals. It considers the number of citations received by a journal and the importance of the journals from where these citations come. SJR acts as an alternative to the Journal Impact Factor (or an average number of citations received in last 2 years). This conference and proceedings has an h-index of 2. The best quartile for this conference and proceedings is -.

The ISSN of IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings conference and proceedings is 26427036, 2641287X. An International Standard Serial Number (ISSN) is a unique code of 8 digits. It is used for the recognition of journals, newspapers, periodicals, and magazines in all kind of forms, be it print-media or electronic. IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings is cited by a total of 17 articles during the last 3 years (Preceding 2024).

IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings Impact IF 2024-2025

The Impact IF 2024 of IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings is 0.22, which is computed in 2025 as per its definition. The impact IF, also denoted as Journal impact score (JIS), of an academic journal is a measure of the yearly average number of citations to recent articles published in that journal. It is based on Scopus data.

IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings h-index

 

IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings has an h-index of 2. It means 2 articles of this conference and proceedings have more than 2 number of citations. The h-index is a way of measuring the productivity and citation impact of the publications. The h-index is defined as the maximum value of h such that the given journal/author has published h papers that have each been cited at least h number of times.

IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings ISSN

The ISSN of IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings is 26427036, 2641287X. ISSN stands for International Standard Serial Number.

An ISSN is a unique code of 8 digits. It is used for the recognition of journals, newspapers, periodicals, and magazines in all kind of forms, be it print-media or electronic.

IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings Rank and SCImago Journal Rank (SJR)

The overall rank of IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings is 26611. According to SCImago Journal Rank (SJR), this conference and proceedings is ranked 0.127. SCImago Journal Rank is an indicator, which measures the scientific influence of journals. It considers the number of citations received by a journal and the importance of the journals from where these citations come.

SJR of IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings by Year

Ranking of IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings by Year

IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings Publisher

IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings is published by Institute of Electrical and Electronics Engineers Inc.. It's publishing house is located in United States. Coverage history of this conference and proceedings is as following: 2023-2024. The organization or individual who handles the printing and distribution of printed or digital publications is known as Publisher.

Call For Papers

Visit the official website of the journal/conference to check the further details about the call for papers.

Abbreviation

The IS0 4 standard abbreviation of IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings is IEEE Int. Symp. Des. Technol. Electron. Packages SIITME - Conf. Proc.. This abbreviation ('IEEE Int. Symp. Des. Technol. Electron. Packages SIITME - Conf. Proc.') is well recommended and approved for the purpose of indexing, abstraction, referencing and citing goals. It meets all the essential criteria of ISO 4 standard.

ISO 4 (International Organization for Standardization 4) is an international standard that defines a uniform and consistent system for abbreviating serial publication titles and journals.

How to publish in IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings

If your research field is/are related to Artificial Intelligence; Control and Optimization; Electrical and Electronic Engineering; Electronic, Optical and Magnetic Materials; Instrumentation; Safety, Risk, Reliability and Quality, then please visit the official website of this conference and proceedings.

Acceptance Rate

The acceptance rate/percentage of any academic journal/conference depends upon many parameters. Some of the critical parameters are listed below.

• The demand or interest of researchers/scientists in publishing in a specific Journal/Conference.
• Peer review complexity and timeline.
• The mix of unsolicited and invited submissions.
• The time it takes from manuscript submission to final publication.
• And Many More.

It is essential to understand that the acceptance rate/rejection rate of papers varies among journals. Some Journals considers all the manuscripts submissions as a basis of acceptance rate computation. On the other hand, few consider the only manuscripts sent for peer review or few even not bother about the accurate maintenance of total submissions. Hence, it can provide a rough estimation only.

The best way to find out the acceptance rate is to reach out to the associated editor or to check the official website of the Journal/Conference.

Credits and Sources

• Scimago Journal & Country Rank (SJR), https://www.scimagojr.com/
• Journal Impact Factor, https://clarivate.com/