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2019 IEEE Technology and Engineering Management Conference, TEMSCON 2019- Impact Score, Overall Ranking, h-index, SJR, Rating, Publisher, ISSN, and Other Important Metrics

Last Updated on November 16, 2021

Impact Score

0.75

h-Index

 4

Rank

 23551

SJR

 0.146

Note: The impact score shown here is equivalent to the average number of times documents published in a journal/conference in the past two years have been cited in the current year (i.e., Cites / Doc. (2 years)). It is based on Scopus data and can be a little higher or different compared to the impact factor (IF) produced by Journal Citation Report. Please refer to the Web of Science data source to check the exact journal impact factor ™ (Thomson Reuters) metric.

Important Metrics

Title 2019 IEEE Technology and Engineering Management Conference, TEMSCON 2019
Abbreviation 2019 IEEE Technol. Eng. Manag. Conf. TEMSCON 2019
Publication Type Conference and proceedings
Subject Area, Categories, Scope Engineering (miscellaneous); Hardware and Architecture; Industrial and Manufacturing Engineering; Management of Technology and Innovation; Safety, Risk, Reliability and Quality
h-index 4
Overall Rank/Ranking 23551
SCImago Journal Rank (SJR) 0.146
Impact Score 0.75
Publisher
Country United States
ISSN -


About 2019 IEEE Technology and Engineering Management Conference, TEMSCON 2019


2019 IEEE Technology and Engineering Management Conference, TEMSCON 2019 is a conference and proceedings covering the technologies/fields/categories related to Engineering (miscellaneous); Hardware and Architecture; Industrial and Manufacturing Engineering; Management of Technology and Innovation; Safety, Risk, Reliability and Quality. It is published by . The overall rank of 2019 IEEE Technology and Engineering Management Conference, TEMSCON 2019 is 23551. According to SCImago Journal Rank (SJR), this conference and proceedings is ranked 0.146. SCImago Journal Rank is an indicator, which measures the scientific influence of journals. It considers the number of citations received by a journal and the importance of the journals from where these citations come. SJR acts as an alternative to the Journal Impact Factor (or an average number of citations received in last 2 years). This conference and proceedings has an h-index of 4. The best quartile for this conference and proceedings is -.

The ISSN of 2019 IEEE Technology and Engineering Management Conference, TEMSCON 2019 conference and proceedings is -. An International Standard Serial Number (ISSN) is a unique code of 8 digits. It is used for the recognition of journals, newspapers, periodicals, and magazines in all kind of forms, be it print-media or electronic. 2019 IEEE Technology and Engineering Management Conference, TEMSCON 2019 is cited by a total of 40 articles during the last 3 years (Preceding 2020).


2019 IEEE Technology and Engineering Management Conference, TEMSCON 2019 Impact Score 2020-2021


The impact score (IS) 2020 of 2019 IEEE Technology and Engineering Management Conference, TEMSCON 2019 is 0.75, which is computed in 2021 as per its definition. The impact score (IS), also denoted as Journal impact score (JIS), of an academic journal is a measure of the yearly average number of citations to recent articles published in that journal. It is based on Scopus data.

Table Setting


Impact Score Trend


Year wise Impact Score (IS) of 2019 IEEE Technology and Engineering Management Conference, TEMSCON 2019. Based on Scopus data.


Year Impact Score (IS)
2021/2022 Coming Soon
2020 0.75
2019 0.00
2018 ''
2017 ''
2016 ''
2015 ''
2014 ''

2019 IEEE Technology and Engineering Management Conference, TEMSCON 2019 h-index


  Table Setting

2019 IEEE Technology and Engineering Management Conference, TEMSCON 2019 has an h-index of 4. It means 4 articles of this conference and proceedings have more than 4 number of citations. The h-index is a way of measuring the productivity and citation impact of the publications. The h-index is defined as the maximum value of h such that the given journal/author has published h papers that have each been cited at least h number of times.




2019 IEEE Technology and Engineering Management Conference, TEMSCON 2019 ISSN


The ISSN of 2019 IEEE Technology and Engineering Management Conference, TEMSCON 2019 is -. ISSN stands for International Standard Serial Number.

An ISSN is a unique code of 8 digits. It is used for the recognition of journals, newspapers, periodicals, and magazines in all kind of forms, be it print-media or electronic.

Table Setting

2019 IEEE Technology and Engineering Management Conference, TEMSCON 2019 Rank and SCImago Journal Rank (SJR)


The overall rank of 2019 IEEE Technology and Engineering Management Conference, TEMSCON 2019 is 23551. According to SCImago Journal Rank (SJR), this conference and proceedings is ranked 0.146. SCImago Journal Rank is an indicator, which measures the scientific influence of journals. It considers the number of citations received by a journal and the importance of the journals from where these citations come.


2019 IEEE Technology and Engineering Management Conference, TEMSCON 2019 Publisher


Table Setting

2019 IEEE Technology and Engineering Management Conference, TEMSCON 2019 is published by . It's publishing house is located in United States. Coverage history of this conference and proceedings is as following: 2019. The organization or individual who handles the printing and distribution of printed or digital publications is known as Publisher.


Call For Papers


Visit the official website of the journal/conference to check the further details about the call for papers.


Abbreviation


The IS0 4 standard abbreviation of 2019 IEEE Technology and Engineering Management Conference, TEMSCON 2019 is 2019 IEEE Technol. Eng. Manag. Conf. TEMSCON 2019. This abbreviation ('2019 IEEE Technol. Eng. Manag. Conf. TEMSCON 2019') is well recommended and approved for the purpose of indexing, abstraction, referencing and citing goals. It meets all the essential criteria of ISO 4 standard.

ISO 4 (International Organization for Standardization 4) is an international standard that defines a uniform and consistent system for abbreviating serial publication titles and journals.


How to publish in 2019 IEEE Technology and Engineering Management Conference, TEMSCON 2019


If your research field is/are related to Engineering (miscellaneous); Hardware and Architecture; Industrial and Manufacturing Engineering; Management of Technology and Innovation; Safety, Risk, Reliability and Quality, then please visit the official website of this conference and proceedings.


Acceptance Rate


The acceptance rate/percentage of any academic journal/conference depends upon many parameters. Some of the critical parameters are listed below.

  • The demand or interest of researchers/scientists in publishing in a specific Journal/Conference.
  • Peer review complexity and timeline.
  • The mix of unsolicited and invited submissions.
  • The time it takes from manuscript submission to final publication.
  • And Many More.

It is essential to understand that the acceptance rate/rejection rate of papers varies among journals. Some Journals considers all the manuscripts submissions as a basis of acceptance rate computation. On the other hand, few consider the only manuscripts sent for peer review or few even not bother about the accurate maintenance of total submissions. Hence, it can provide a rough estimation only.

The best way to find out the acceptance rate is to reach out to the associated editor or to check the official website of the Journal/Conference.


Credits and Sources


  • Scimago Journal & Country Rank (SJR), https://www.scimagojr.com/
  • Journal Impact Factor, https://clarivate.com/



Impact Score, h-Index, and Other Important Details of These Journals, Conferences, and Books


Journal/Conference/Workshop/Book Title Type Ranking Publisher h-index Impact Score
International Journal on Software Tools for Technology Transfer journal 12200 Springer Verlag 55 2.41
Neural Plasticity journal 2947 Hindawi Publishing Corporation 68 3.27
PSAM 2016 - 13th International Conference on Probabilistic Safety Assessment and Management conference and proceedings 25813 3 0.00
Cardiovascular Intervention and Therapeutics journal 9658 Springer Verlag 17 1.61
DIDL 2017 - Proceedings of the 1st Workshop on Distributed Infrastructures for Deep Learning, Part of Middleware 2017 conference and proceedings 21951 2 0.00
Child and Adolescent Psychiatric Clinics of North America journal 7413 W.B. Saunders Ltd 71 2.02
International Journal of Electrical Engineering journal 30212 8 0.13
2017 IEEE Colombian Conference on Communications and Computing, COLCOM 2017 - Proceedings conference and proceedings 19904 5 0.00
Journal of Addictions and Offender Counseling journal 16844 Wiley-Blackwell 16 0.75
Proceedings of the 2017 IEEE 24th International Congress on Electronics, Electrical Engineering and Computing, INTERCON 2017 conference and proceedings 24365 8 0.00

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