Title | EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging |
Abbreviation | EMAP 2018 - 2018 20th Int. Conf. Electron. Mater. Packag. |
Publication Type | Conference and proceedings |
Subject Area, Categories, Scope | Electronic, Optical and Magnetic Materials |
h-index | 3 |
Overall Rank/Ranking | 27535 |
SCImago Journal Rank (SJR) | 0.116 |
Impact Score | 0.15 |
Publisher | |
Country | United States |
ISSN | - |
Best Quartile | - |
Coverage History |
EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging is a conference and proceedings covering the technologies/fields/categories related to Electronic, Optical and Magnetic Materials. It is published by . The overall rank of EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging is 27535. According to SCImago Journal Rank (SJR), this conference and proceedings is ranked 0.116. SCImago Journal Rank is an indicator, which measures the scientific influence of journals. It considers the number of citations received by a journal and the importance of the journals from where these citations come. SJR acts as an alternative to the Journal Impact Factor (or an average number of citations received in last 2 years). This conference and proceedings has an h-index of 3. The best quartile for this conference and proceedings is -.
The ISSN of EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging conference and proceedings is -. An International Standard Serial Number (ISSN) is a unique code of 8 digits. It is used for the recognition of journals, newspapers, periodicals, and magazines in all kind of forms, be it print-media or electronic. EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging is cited by a total of 8 articles during the last 3 years (Preceding 2020).
The Impact IF 2020 of EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging is 0.15, which is computed in 2021 as per its definition. The impact IF, also denoted as Journal impact score (JIS), of an academic journal is a measure of the yearly average number of citations to recent articles published in that journal. It is based on Scopus data.
Year | Impact IF |
---|---|
2023/2024 | Coming Soon |
2020 | 0.15 |
EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging has an h-index of 3. It means 3 articles of this conference and proceedings have more than 3 number of citations. The h-index is a way of measuring the productivity and citation impact of the publications. The h-index is defined as the maximum value of h such that the given journal/author has published h papers that have each been cited at least h number of times.
The ISSN of EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging is -. ISSN stands for International Standard Serial Number.
An ISSN is a unique code of 8 digits. It is used for the recognition of journals, newspapers, periodicals, and magazines in all kind of forms, be it print-media or electronic.
The overall rank of EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging is 27535. According to SCImago Journal Rank (SJR), this conference and proceedings is ranked 0.116. SCImago Journal Rank is an indicator, which measures the scientific influence of journals. It considers the number of citations received by a journal and the importance of the journals from where these citations come.
Year | SJR |
---|---|
2023/2024 | Coming Soon |
2020 | 0.116 |
Year | Ranking |
---|---|
2023/2024 | Coming Soon |
2020 | 27535 |
EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging is published by . It's publishing house is located in United States. Coverage history of this conference and proceedings is as following: . The organization or individual who handles the printing and distribution of printed or digital publications is known as Publisher.
Visit the official website of the journal/conference to check the further details about the call for papers.
The IS0 4 standard abbreviation of EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging is EMAP 2018 - 2018 20th Int. Conf. Electron. Mater. Packag.. This abbreviation ('EMAP 2018 - 2018 20th Int. Conf. Electron. Mater. Packag.') is well recommended and approved for the purpose of indexing, abstraction, referencing and citing goals. It meets all the essential criteria of ISO 4 standard.
ISO 4 (International Organization for Standardization 4) is an international standard that defines a uniform and consistent system for abbreviating serial publication titles and journals.
If your research field is/are related to Electronic, Optical and Magnetic Materials, then please visit the official website of this conference and proceedings.
The acceptance rate/percentage of any academic journal/conference depends upon many parameters. Some of the critical parameters are listed below.
It is essential to understand that the acceptance rate/rejection rate of papers varies among journals. Some Journals considers all the manuscripts submissions as a basis of acceptance rate computation. On the other hand, few consider the only manuscripts sent for peer review or few even not bother about the accurate maintenance of total submissions. Hence, it can provide a rough estimation only.
The best way to find out the acceptance rate is to reach out to the associated editor or to check the official website of the Journal/Conference.
EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging latest impact IF is 0.15. It's evaluated in the year 2020. The highest and the lowest impact IF or impact score of this conference and proceedings are 0.15 (2020) and 0.15 (2020), respectively, in the last 1 year. Moreover, its average IS is 0.15 in the previous 1 year.
The EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging has an SJR (SCImago Journal Rank) of 0.116, according to the latest data. It is computed in the year 2021. In the past 1 years, this conference and proceedings has recorded a range of SJR, with the highest being 0.116 in 2020 and the lowest being 0.116 in 2020. Furthermore, the average SJR of the EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging over the previous 1-year period stands at 0.15.
The latest h-index of the EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging is 3.
The EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging is published by the , with its country of publication being the United States.
The EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging is currently ranked 27535 out of 27955 Journals, Conferences, and Book Series in the latest ranking. Over the course of the last 1 year, this conference and proceedings has experienced varying rankings, reaching its highest position of 27535 in 2020 and its lowest position of 27535 in 2020.
The standard ISO4 abbreviation for the EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging is EMAP 2018 - 2018 20th Int. Conf. Electron. Mater. Packag..
EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging is classified as a conference and proceedings that the publishes.
The EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging encompasses the following areas:
For a more comprehensive understanding of its scope, check the official website of this conference and proceedings.
Journal/Conference/Workshop/Book Title | Type | Ranking | Publisher | h-index | Impact Score |
---|---|---|---|---|---|
Zeitschrift fur Germanistische Linguistik | journal | 22945 | De Gruyter Mouton | 15 | 0.19 |
European Union Politics | journal | 2250 | SAGE Publications Ltd | 72 | 2.64 |
Analysis in Theory and Applications | journal | 19346 | Springer Netherlands | 11 | 0.00 |
Milan Journal of Mathematics | journal | 3120 | Birkhauser Verlag Basel | 28 | 1.79 |
Journal of Classical Sociology | journal | 13766 | SAGE Publications Ltd | 27 | 0.83 |
Discourse | journal | 6621 | Routledge | 59 | 2.11 |
Child and Family Social Work | journal | 8628 | Wiley-Blackwell Publishing Ltd | 67 | 2.20 |
Socialism and Democracy | journal | 26162 | Taylor and Francis Ltd. | 17 | 0.09 |
Korean Journal of Applied Microbiology and Biotechnology | journal | 22033 | Korean Society for Applied Microbiology | 0 | 0.00 |
Sapporo Medical Journal | journal | 20468 | Cancer Research Institute, Sapporo Medical University | 3 | 0.00 |
Year | Impact Score (IS) |
---|---|
2021/2022 | Coming Soon |
2020 | 0.15 |