| Title | THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings |
| Abbreviation | THERMINIC 2018 - 24th Int. Workshop Therm. Investig. ICs Syst. Proc. |
| Publication Type | Conference and proceedings |
| Subject Area, Categories, Scope | Electrical and Electronic Engineering; Electronic, Optical and Magnetic Materials; Fluid Flow and Transfer Processes; Instrumentation; Safety, Risk, Reliability and Quality |
| h-index | 9 |
| Overall Rank/Ranking | 22346 |
| SCImago Journal Rank (SJR) | 0.159 |
| Impact Score | 0.90 |
| Publisher | |
| Country | United States |
| ISSN | - |
| Best Quartile | - |
| Coverage History |
THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings is a conference and proceedings covering the technologies/fields/categories related to Electrical and Electronic Engineering; Electronic, Optical and Magnetic Materials; Fluid Flow and Transfer Processes; Instrumentation; Safety, Risk, Reliability and Quality. It is published by . The overall rank of THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings is 22346. According to SCImago Journal Rank (SJR), this conference and proceedings is ranked 0.159. SCImago Journal Rank is an indicator, which measures the scientific influence of journals. It considers the number of citations received by a journal and the importance of the journals from where these citations come. SJR acts as an alternative to the Journal Impact Factor (or an average number of citations received in last 2 years). This conference and proceedings has an h-index of 9. The best quartile for this conference and proceedings is -.
The ISSN of THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings conference and proceedings is -. An International Standard Serial Number (ISSN) is a unique code of 8 digits. It is used for the recognition of journals, newspapers, periodicals, and magazines in all kind of forms, be it print-media or electronic. THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings is cited by a total of 55 articles during the last 3 years (Preceding 2020).
The Impact IF 2020 of THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings is 0.90, which is computed in 2021 as per its definition. The impact IF, also denoted as Journal impact score (JIS), of an academic journal is a measure of the yearly average number of citations to recent articles published in that journal. It is based on Scopus data.
| Year | Impact IF |
|---|---|
| 2023/2024 | Coming Soon |
| 2020 | 0.90 |
THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings has an h-index of 9. It means 9 articles of this conference and proceedings have more than 9 number of citations. The h-index is a way of measuring the productivity and citation impact of the publications. The h-index is defined as the maximum value of h such that the given journal/author has published h papers that have each been cited at least h number of times.
The ISSN of THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings is -. ISSN stands for International Standard Serial Number.
An ISSN is a unique code of 8 digits. It is used for the recognition of journals, newspapers, periodicals, and magazines in all kind of forms, be it print-media or electronic.
The overall rank of THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings is 22346. According to SCImago Journal Rank (SJR), this conference and proceedings is ranked 0.159. SCImago Journal Rank is an indicator, which measures the scientific influence of journals. It considers the number of citations received by a journal and the importance of the journals from where these citations come.
| Year | SJR |
|---|---|
| 2023/2024 | Coming Soon |
| 2020 | 0.159 |
| Year | Ranking |
|---|---|
| 2023/2024 | Coming Soon |
| 2020 | 22346 |
THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings is published by . It's publishing house is located in United States. Coverage history of this conference and proceedings is as following: . The organization or individual who handles the printing and distribution of printed or digital publications is known as Publisher.
Visit the official website of the journal/conference to check the further details about the call for papers.
The IS0 4 standard abbreviation of THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings is THERMINIC 2018 - 24th Int. Workshop Therm. Investig. ICs Syst. Proc.. This abbreviation ('THERMINIC 2018 - 24th Int. Workshop Therm. Investig. ICs Syst. Proc.') is well recommended and approved for the purpose of indexing, abstraction, referencing and citing goals. It meets all the essential criteria of ISO 4 standard.
ISO 4 (International Organization for Standardization 4) is an international standard that defines a uniform and consistent system for abbreviating serial publication titles and journals.
If your research field is/are related to Electrical and Electronic Engineering; Electronic, Optical and Magnetic Materials; Fluid Flow and Transfer Processes; Instrumentation; Safety, Risk, Reliability and Quality, then please visit the official website of this conference and proceedings.
The acceptance rate/percentage of any academic journal/conference depends upon many parameters. Some of the critical parameters are listed below.
It is essential to understand that the acceptance rate/rejection rate of papers varies among journals. Some Journals considers all the manuscripts submissions as a basis of acceptance rate computation. On the other hand, few consider the only manuscripts sent for peer review or few even not bother about the accurate maintenance of total submissions. Hence, it can provide a rough estimation only.
The best way to find out the acceptance rate is to reach out to the associated editor or to check the official website of the Journal/Conference.
THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings latest impact IF is 0.90. It's evaluated in the year 2020. The highest and the lowest impact IF or impact score of this conference and proceedings are 0.90 (2020) and 0.90 (2020), respectively, in the last 1 year. Moreover, its average IS is 0.9 in the previous 1 year.
The THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings has an SJR (SCImago Journal Rank) of 0.159, according to the latest data. It is computed in the year 2021. In the past 1 years, this conference and proceedings has recorded a range of SJR, with the highest being 0.159 in 2020 and the lowest being 0.159 in 2020. Furthermore, the average SJR of the THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings over the previous 1-year period stands at 0.9.
The latest h-index of the THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings is 9.
The THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings is published by the , with its country of publication being the United States.
The THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings is currently ranked 22346 out of 27955 Journals, Conferences, and Book Series in the latest ranking. Over the course of the last 1 year, this conference and proceedings has experienced varying rankings, reaching its highest position of 22346 in 2020 and its lowest position of 22346 in 2020.
The standard ISO4 abbreviation for the THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings is THERMINIC 2018 - 24th Int. Workshop Therm. Investig. ICs Syst. Proc..
THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings is classified as a conference and proceedings that the publishes.
The THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings encompasses the following areas:
For a more comprehensive understanding of its scope, check the official website of this conference and proceedings.
| Journal/Conference/Workshop/Book Title | Type | Ranking | Publisher | h-index | Impact Score |
|---|---|---|---|---|---|
| Revue Francophone des Laboratoires (discontinued) | journal | 23244 | Elsevier Masson s.r.l. | 8 | 0.00 |
| Current Sociology | journal | 6591 | SAGE Publications Ltd | 76 | 2.29 |
| Entrepreneurship Theory and Practice | journal | 338 | Wiley-Blackwell | 185 | 12.75 |
| Transnational Corporations | journal | 6120 | UNCTAD United Nations Conference on Trade and Development | 27 | 1.92 |
| Howard Journal of Communications | journal | 9564 | Taylor and Francis Ltd. | 36 | 1.66 |
| Natural Solutions | trade journal | 28581 | Innovision Health Media | 1 | 0.00 |
| International Conference on Architectural Support for Programming Languages and Operating Systems - ASPLOS | conference and proceedings | 781 | Association for Computing Machinery (ACM) | 100 | 8.01 |
| Archiv fur Geflugelkunde | journal | 28770 | Verlag Eugen Ulmer | 30 | 0.00 |
| Proceedings of the Royal Society of Queensland | journal | 22998 | Royal Society of Queensland | 12 | 0.48 |
| Physics and Chemistry of the Earth | journal | 12927 | Pergamon Press Ltd. | 33 | 0.00 |
| Year | Impact Score (IS) |
|---|---|
| 2021/2022 | Coming Soon |
| 2020 | 0.90 |
