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TSP 2020 : 43rd International Conference on Telecommunications and Signal Processing - IEEE R8 - IEEE Xplore - SCOPUS

Milan, Italy

Event Date:	July 07, 2020 - July 09, 2020
Submission Deadline:	February 15, 2020
Notification of Acceptance:	April 15, 2020
Camera Ready Version Due:	April 30, 2020

About

In cooperation with the IEEE Region 8 (Europe, Middle East and Africa), IEEE Italy Section, Italy Section SP Chapter, Italy Section VT/COM Joint Chapter, IEEE Czechoslovakia Section, IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, and Scientific Association for Infocommunications, a Sister Society of the IEEE and the IEEE Communications Society, the TSP 2020 is organized by eighteen universities from Czech Republic, Hungary, Turkey, Croatia, Taiwan, Japan, Slovak Republic, Spain, Bulgaria, France, Romania, Slovenia, Greece, and Poland, for academics, researchers, and developers and it serves as a premier annual international forum to promote the exchange of the latest advances in telecommunication technology and signal processing. The aim of the conference is to bring together both novice and experienced scientists, developers, and specialists, to meet new colleagues, collect new ideas, and establish new cooperation between research groups from universities, research centers, and private sectors from the whole Europe, America, Asia, Australia, and Africa. The international expansion motivates the organizers in their effort to providing a platform for exchanging information and experience to help to improve the level and extent of scientific cooperation between university students, academics, and employees of research centers. The official language of the conference is English.

All the accepted papers will be published in the conference proceedings issued online, which (containing only presented papers at the conference) will be submitted for indexing to the IEEE Xplore® Digital Library – IEEE Conference Record #49548, Conference Proceedings Citation Index (CPCI) of Thomson Reuters (formerly ISI Proceedings), SCOPUS, DBLP, and Google Scholardatabases.

After the conference, authors of about 25% highest rated papers will also be invited to submit the extended version for publishing in special issues of international journals:

High quality papers will be invited to submit an extended version of their work for potential publication in a Special Issue Selected Papers from the 2020 43rd International Conference on Telecommunications and Signal Processing (TSP) of an international journal Applied Sciences (ISSN 2076-3417; CODEN: ASPCC7), an international peer-reviewed open access journal on all aspects of applied natural sciences published by MDPI and indexed by Web of Science (2018 JCR Q2/Q3; Impact Factor: 2.217), Scopus, Inspec, etc. The submitted papers must have at least 50% new material from the conference original papers.

Guest Editors: Assoc. Prof. Norbert Herencsar (Brno University of Technology, Czech Republic); Prof. Dr. Francesco Benedetto (University of “Roma TRE”, Italy), Assoc. Prof. Jorge Crichigno (University of South Carolina, USA).
The extended version of selected TSP 2018 papers will be published in the International Journal of Advances in Telecommunications, Electrotechnics, Signals and Systems (IJATES) journal (ISSN: 1805-5443) – indexed by Google Scholar, CrossRef, WorldCat, EZB Elektronischen Zeitschriftenbibliothek, and Directory of Open Access Journals (DOAJ) (papers to be published after significant extension and new review process).

Call for Papers

The 2020 43rd International Conference on Telecommunications and Signal Processing (TSP) will be held in Milan, Italy during July 7-9, 2020. The TSP 2020 Conference will focus on all areas of telecommunications and signal processing. Topics of interest include, but are not limited to:

Telecommunications

Signal Processing

Information Systems

Customer relationship management (CRM)
Cyber security, and others
Data warehouses and data mining
Enterprise systems (ERP)
eBusiness
eBanking
eGovernment
Information system design and development
Knowledge engineering and discovery
Knowledge extraction and search
System integration in economic environment

Network Services

Ad-hoc networks
Big data and related topics
Internet and cloud computing
Multimedia services and telematics
Network management and security
Network service design, development, and others

Telecommunication Systems

Embedded systems
Energy-efficient communication protocols
Infrastructures and protocols for smart grids
Measurement, monitoring and diagnostics
Power management for telecommunication equipment
System design and development
Virtualization techniques, platforms and solutions, and others

Modelling, Simulation and Measurement

Analytical models of communication technologies and systems
Antennas design and modelling
Electromagnetic compatibility
Model-driven design and development
Network monitoring, performance and quality evaluation techniques
Network simulation and measurement techniques
Radars, propagation, and measurements
Traffic and workload control, and others
UWB systems & technology

Analog Signal Processing

Active devices, circuits, and applications
CAD tools and SoC design
Cellular neural networks and array computing
Circuit theory and numerical methods
Communication circuits and systems
Fractional calculus, fractional-order circuits’ synthesis and analysis
Low-voltage and low-power circuits, MOS-only circuits
Memristive circuits and devices
Nonlinear signal processing & chaos
Power and energy circuits and systems
VLSI systems and applications, and others

Audio, Speech and Language Processing

Acoustic modeling and source separation
Analysis, coding, recognition and synthesis of audio, music, speech and language
General language modeling, mining, and spoken dialog systems
Speech production and perception
Spoken language detection and modeling, and others

Biomedical Signal Processing

Biocomputing and biochips
Bioinformatics, biomechanics, biorobotics
Biomedical metrology
Biomedical sensors and systems
Biometrics and related topics
Electromagnetic fields in biology and medicine
Health monitoring devices
Wearable & implantable technologies, and others

Digital Signal Processing

Adaptive and non-linear signal processing
Array signal processing
Digital filters and filter banks
DSP algorithms and applications
Multidimensional signal processing
Signal analysis, transform, and reconstruction
Signal processing for smart sensor and systems
Social signal processing and affective computing, and others

Image and Video Signal Processing

Computer vision
Digital television, DVB, DAB, DMB
Image and video analysis, segmentation, and tracking
Image filtering
Morphological processing
Pattern recognition
Watermarking, and others

Author Guidelines, Paper Submission Information, and Proceedings Indexing

Prospective authors are invited to submit full-length original and previously unpublished papers in PDF format via the OpenConf Peer Review & Conference Management System. Authors must use the official TSP 2020 template in LaTeX, MS Word, or Lyxformat to prepare the paper (LaTeX is mainly preferred). The best way to have your paper met the format requirements is to copy and paste your paper into the template file. The paper should not exceed 4 pages including figures, tables & references. Maximum 3 additional pages are allowed with extra payment. Papers exceeding 7 pages will be automatically rejected. Submitted papers will undergo blind peer-review process by two to four members of the Technical Programmee Committee and Organizing Committee Members. Student reviewers are not used. According to TSP policy all papers with one reject decision from the reviewers are automatically rejected. Review results will be sent to all authors by e-mail given during the paper submission. Students, IEEE Members, and TSP Reviewers will receive discount on registration fee.

Summary

TSP 2020 : 43rd International Conference on Telecommunications and Signal Processing - IEEE R8 - IEEE Xplore - SCOPUS will take place in Milan, Italy. It’s a 3 days event starting on Jul 07, 2020 (Tuesday) and will be winded up on Jul 09, 2020 (Thursday).

TSP 2020 falls under the following areas: COMPUTER SCIENCE, SIGNAL PROCESSING, MACHINE LEARNING, SECURITY, etc. Submissions for this Conference can be made by Feb 15, 2020. Authors can expect the result of submission by Apr 15, 2020. Upon acceptance, authors should submit the final version of the manuscript on or before Apr 30, 2020 to the official website of the Conference.

Please check the official event website for possible changes before you make any travelling arrangements. Generally, events are strict with their deadlines. It is advisable to check the official website for all the deadlines.

Other Details of the TSP 2020

Short Name: TSP 2020
Full Name: 43rd International Conference on Telecommunications and Signal Processing - IEEE R8 - IEEE Xplore - SCOPUS
Timing: 09:00 AM-06:00 PM (expected)
Fees: Check the official website of TSP 2020
Event Type: Conference
Website Link: https://tsp.vutbr.cz/
Location/Address: Milan, Italy

Credits and Sources

[1] TSP 2020 : 43rd International Conference on Telecommunications and Signal Processing - IEEE R8 - IEEE Xplore - SCOPUS