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Springer--IIP--EI and Inspec 2022 : Springer--2022 The 12th International Conference on Intelligent Information Processing (IIP 2022)--EI and Inspec
Springer--IIP--EI and Inspec 2022 : Springer--2022 The 12th International Conference on Intelligent Information Processing (IIP 2022)--EI and Inspec

Springer--IIP--EI and Inspec 2022 : Springer--2022 The 12th International Conference on Intelligent Information Processing (IIP 2022)--EI and Inspec

Qingdao, China
Event Date: May 27, 2022 - May 30, 2022
Submission Deadline: March 10, 2022




Call for Papers

★Full Name: Springer--2022 The 12th International Conference on Intelligent Information Processing (IIP 2022)--EI and Inspec
★Abbreviation: IIP 2022

★Date: May 27-30, 2022
★Venue: Qingdao, China
★Website: https://cise.sdust.edu.cn/iip2022/

★The IFIP IIP conference series provides a forum for engineers and scientists in academia, university and industry to present their latest research findings in any aspects of intelligent information processing.

★Topics of IIP2022 include, but are not limited to:
Automatic reasoning
Big data mining
Bioinformatics
Brain-machine systems
Business intelligence
Cloud computing
Cognitive Modeling
Computational intelligence
Computer vision
Constraints and satisfiability
Cross-media mining
Deep learning
Evolutionary computation
Game theory
Granular computing
Image processing
Information retrieval
Intelligence Science
Internet of things
Knowledge-based systems
Knowledge engineering
Knowledge representation
Logics and logic programming
Machine learning
Multi-agent systems
Natural language processing
Neural computing
Ontology engineering
Speech understanding and interaction
Text understanding
Web intelligence
Very large knowledge systems

★Organization Committees
--General Chairs
Eunika Mercier-Laurent (France)
Ming Li (Canada)
Qingtian Zeng (China)

--Program Chairs
Zhongzhi Shi (China)
Jean-daniel Zucker (France)
Bo An (Singapore)

★Local Organization Committees
--Organizing Chair
Yongquan Liang (China)

--General Secretary
Shujuan Ji (China)

--Vice General Secretary
Zhongying Zhao (China)

★Keynote and Invited Speakers
--Jie Lu
Director of Australian Artificial Intelligence Institute
University of Technology Sydney, Australia
--Title
Concept Drift Detection, Understanding and Adaptation

--Xin Yao
Research Institute of Trustworthy Autonomous Systems (RITAS)
Department of Computer Science and Engineering
Southern University of Science and Technology (SUSTech), Shenzhen, China
and School of Computer Science,University of Birmingham,UK
--Title
Making Machine Learning Fairer

--Ho-fung Leung
Professor, Department of Computer Science and Engineering, CUHK
Professor (by courtesy), Department of Sociology, CUHK
--Title
Interactions of Agents

--Bao-Liang Lu
Center for Brain-Like Computing and Machine Intelligence
Department of Computing Science and Engineering
Shanghai Jiao Tong University, Shanghai 200240, China
--Title
Affective Brain-Computer Interface and Application

--Dongrui Wu
School of Artificial Intelligence and Automation,
Huazhong University of Science and Technology, China
--Title
Accurate, Secure and Privacy-Preserving Brain-Computer Interfaces

--Yang Yu
School of Artificial Intelligence, National Key Laboratory for Novel Software Technology, Nanjing University, China
--Title
General Real-world Decision-making by Offline Reinforcement Learning

--Chuan Shi
School of Computer Science
Beijing University of Posts and Telecommunications,China
--Title
Rethinking the Learning Mechanism of GNN

★Publication
The proceedings will be published by the Springer.
All accepted papers will be indexed by EI and Inspec.

★Paper Submission
Long paper should be 12-15 pages, short paper should be 5-8 pages, including all tables, figures, and references but excluding a cover page. Fonts should be in 10 pt. Each submission must include one cover page which should contain:
(1) Title of the paper with an abstract of no more than 500 words;
(2) A few keywords, from the list above where possible, giving a clear indication of topics;
(3) Author names with affiliations, complete postal addresses, and phone numbers;
(4) Email address of the contact author.

★How to Submit
* Please send your manuscript to EasyChair online submission system:
https://easychair.org/conferences/?conf=iip2022
* For more info. please visit:
https://cise.sdust.edu.cn/iip2022/submission.html


★Workshop
The conference Program Committee invites proposals for workshops, tutorials and panels. Proposals should be received by one of the program chairs no later than 1 January, 2022.

★Contact
--Organizing Chair
Yongquan Liang
E-mail: [email protected]

--General Secretary
Shujuan Ji
E-mail: [email protected]

--Vice General Secretary
Zhongying Zhao
E-mail: [email protected]


Summary

Springer--IIP--EI and Inspec 2022 : Springer--2022 The 12th International Conference on Intelligent Information Processing (IIP 2022)--EI and Inspec will take place in Qingdao, China. It’s a 4 days event starting on May 27, 2022 (Friday) and will be winded up on May 30, 2022 (Monday).

Springer--IIP--EI and Inspec 2022 falls under the following areas: ARTIFICIAL INTELLIGENCE, INFORMATION TECHNOLOGY, SIGNAL PROCESSING, INFORMATION MANAGEMENT, etc. Submissions for this Conference can be made by Mar 10, 2022.

Please check the official event website for possible changes before you make any travelling arrangements. Generally, events are strict with their deadlines. It is advisable to check the official website for all the deadlines.

Other Details of the Springer--IIP--EI and Inspec 2022

  • Short Name: Springer--IIP--EI and Inspec 2022
  • Full Name: Springer--2022 The 12th International Conference on Intelligent Information Processing (IIP 2022)--EI and Inspec
  • Timing: 09:00 AM-06:00 PM (expected)
  • Fees: Check the official website of Springer--IIP--EI and Inspec 2022
  • Event Type: Conference
  • Website Link: https://cise.sdust.edu.cn/iip2022/
  • Location/Address: Qingdao, China


Credits and Sources

[1] Springer--IIP--EI and Inspec 2022 : Springer--2022 The 12th International Conference on Intelligent Information Processing (IIP 2022)--EI and Inspec


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