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SCIM 2022 : Special Issue: Sensing, Computing and Imaging in 3D Microscopy
SCIM 2022 : Special Issue: Sensing, Computing and Imaging in 3D Microscopy

SCIM 2022 : Special Issue: Sensing, Computing and Imaging in 3D Microscopy

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Submission Deadline: March 31, 2022




Call for Papers

Dear Colleagues,

In recent years, the development of microscopy methods that exploit the use of non-conventional sensing and the power of image processing has provided a wide range of new applications in different fields, such as biomedical research, materials science, microfluidics, etc. This Special Issue is devoted to providing a general view of recent advances in 3D microscopy, highlighting methods that provide additional information about microscopic samples through non-conventional sensing approaches. For instance, superresolution techniques retrieve high-resolution information of specimens that is not attainable in a conventional microscope. Other techniques such as quantitative phase imaging or Brillouin microscopy measure the morphological properties of microscopic samples by means of conventional intensity sensors. Light-field microscopy and Fourier ptychography are based on multiplexing the spatio-angular information of the sample in the sensor plane. These techniques, among others, combine conventional optics with unique sensing and computing approaches, leading to novel paths to inspect and characterize samples.

The contributions to this Issue can be original research articles or reviews regarding the state-of-the-art of an already existing technique.

Topics may include but are not limited to:

- Quantitative-phase imaging microscopy;

- Brillouin microscopy;

- Light-field microscopy;

- Fourier ptychography;

- Superresolution microscopy;

- Optical sectioning

Dr. Emilio Sánchez-Ortiga
Guest Editor


Credits and Sources

[1] SCIM 2022 : Special Issue: Sensing, Computing and Imaging in 3D Microscopy


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