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IEEE MMSP 2020 will be held on September 21-23, 2020 in the vibrant city of Tampere, Finland. Tampere is known for its active science and business community, nice location on a scenic spot between two great lakes, and world-class services for its citizens and visitors. It is a lively city, which welcomes millions of congress goers every year. Tampere is easily reachable by air, train and car and offers excellent hosting for any budget.
The workshop is 22nd in the series, organized by the Multimedia Signal Processing Technical Committee of the IEEE Signal Processing Society (SPS), with the aim to bring together researchers and practitioners from academia and industry, passionate about multimedia signal processing, to share their knowledge, exchange ideas, explore future research directions and network.
Prospective authors are invited to submit regular and special session papers (full length, 4-6 pages) and demo papers (1 page). All accepted papers will be included in the IEEE Xplore and indexed by Scopus and EI. Papers are solicited in, but not limited to, the following areas:
Image / video compression
Image / video restoration and processing
Machine listening for analysis of acoustic scenes
Speech / music / audio processing
Sound source localization and separation
Multimedia communications and networking
Multimedia quality assessment
Internet of Things (IoT)-based multimedia systems and applications
Multimedia hardware design
Multimedia databases and digital libraries
Multimedia security and forensics Multimedia interaction
Multimedia big data analytics
Deep Learning for Multimedia
Multimedia processing for tele-medicine and health care
Augmented, mixed and virtual reality
Multimedia systems for emerging applications
Tentative Timeline
Special Session/Workshop proposal submission – early April, 2020
Regular paper submission – mid May, 2020
Notification of paper acceptance – mid July, 2020
Camera-ready paper submission – late July, 2020
Demo paper submission – mid August, 2020
General chairs:
Atanas Gotchev, Tampere University, Finland
Dong Tian, InterDigital, USA
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