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The topics of interest include (but not limited):
* Analog, digital, mixed, and RF circuits and related design methodologies
* Analog-to-Digital Converters (ADC)
* Voltage-to-Frequency Converts (VFC)
* Frequency-to-Digital Converters (FDC)
* Time-to-Digital Converters (TDC)
* Logic, architectural, and system level synthesis
* Nonlinear circuits
* Microprocessors, microcontrollers and DSPs
* Testing, design for testability, built-in self-test
* Area, power, and thermal analysis and design
* Mixed-domain simulation and design
* Embedded systems, low-power designs
* VLSI systems circuit and design
* Non-von Neumann computing and related technologies and circuits
* Design and test of high complexity systems integration
* SoC, MPSoC, NoC, SIP, and NIP design and test
* Process technologies, CMOS, BJT, BiCMOS, GaAs
* 3-D integration design and analysis
* Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
* Design for Manufacturability/Technology Optimization/Yield & Quality
* Microelectronics processing and materials
* Semiconductor processing
* Modern electronics materials
* Solid-state electronics
* Quantum electronics
* Thin solid films
* Nanoprocessing, nanotechnology and nanofabrication
* Flexible and stretchable electronics
* MEMS and NEMS
* CAD tools for microelectronics
* Hardware/software co-design
* Algorithms, methods and tools for modeling, simulation, synthesis and verification of ICs
* Electronic materials science and technology
* Organic electronic materials and devices
* Microelectronics reliability and qualification
* Assembly and Packaging
Contribution Types:
• Keynote presentations
• Industrial presentations
• Regular papers
• Posters
Special Sessions:
Authors are welcome to organize and manage special sessions during the conference. Each session will contain 4-6 papers in a related field as specified above.
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