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COMPUTER SCIENCE
ELECTRONIC
MECHANIC
BIOENGINEERING
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Call for Papers |
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CALL FOR PAPERS INTERCON 2023 – XXX International Conference on Electronics, Electrical Engineering and Computing November 02 - 04, 2023 UPC, Lima, Peru http://intercon.org.pe ***************************************************************************** IMPORTANT DATES Paper submission (Extended): August 15, 2023 Notification: September 15, 2023 Camera-ready: October 05, 2023 Author registration deadline: October 12, 2023 ***************************************************************************** The XXX International Conference on Electronics, Electrical Engineering and Computing - INTERCON 2023 is a prestigious international technical conference organized by the IEEE Peru Section to bring together technological applications, knowledge, and understanding. INTERCON 2023 is the XXX version of the conference and is themed around the IEEE Future Directions platforms. The venue of the 2023 edition of INTERCON is UPC (Universidad de Ciencias Aplicadas) and its IEEE UPC Student Branch. We invite you to submit technical papers for oral presentations. INTERCON 2023 aims to continue the legacy of its predecessors by serving as a great platform for researchers to discuss and explore advanced technologies that can advance humanity. TOPICS OF INTEREST Papers presenting original and innovation work in, but not limited to, the following tracks are invited for submission: T1. Artificial Intelligence and Machine learning T2. Communications and Networking T3. Power, Energy, and Power Electronics T4. Biomedical Engineering and Healthcare Technologies T5. Robotics, Control, Instrumentation, and Automation T6. Multimedia Signal Processing and Analytics T7. Devices, Circuits, and Materials T8. RF Circuits, Systems, and Antennas T9. Data Science and Computing Technologies T10. Education in Engineering and Technology SUBMISSION GUIDELINES The conference invites research papers of varying length from 6 to 8 pages (including abstract and references) and written in English. The format of the papers is based on IEEE conference template, which can be downloaded from: https://www.ieee.org/conferences/publishing/templates.html For all accepted papers, the authors will be asked to sign a copyright transfer on the contents of their paper(s). The accepted papers will be indexed and published on the IEEE Xplore Digital Library. All papers, only in PDF file, must be submitted electronically through the EasyChair: https://easychair.org/conferences/?conf=2023ieeeintercon ORGANIZING COMMITTEE ADVISORY COMMITTEE Carlos Silva Cardenas. Ernesto Cuadros Vargas William Ipanaqué Alama. GENERAL CHAIR César A. Beltrán Castañón GENERAL CO-CHAIRS Yván Tupac Valdivia FINANCE CHAIR Jimmy Túllume Salazar PUBLICATION CHAIRS Pedro Shiguihara José Durán Talledo LOCAL CO-CHAIR Carlos Valdez (UPC, Peru) Nikolai Vinces (UPC, Peru) Yohanna Villanueva (UPC, Peru) CONFERENCE CONTACT Marleni Delgado ([email protected]) |
Summary |
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INTERCON 2023 : XXX International Conference on Electronics, Electrical Engineering and Computing will take place in Lima, Perú. It’s a 3 days event starting on Nov 2, 2023 (Thursday) and will be winded up on Nov 4, 2023 (Saturday). INTERCON 2023 falls under the following areas: COMPUTER SCIENCE, ELECTRONIC, MECHANIC, BIOENGINEERING, etc. Submissions for this Conference can be made by Aug 15, 2023. Authors can expect the result of submission by Sep 15, 2023. Upon acceptance, authors should submit the final version of the manuscript on or before Oct 5, 2023 to the official website of the Conference. Please check the official event website for possible changes before you make any travelling arrangements. Generally, events are strict with their deadlines. It is advisable to check the official website for all the deadlines. Other Details of the INTERCON 2023
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Credits and Sources |
| [1] INTERCON 2023 : XXX International Conference on Electronics, Electrical Engineering and Computing |
