Categories |
COMMUNICATION
ALGORITHMS
GRAPHICS
COMPUTING
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About |
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The 2020 IEEE XXVII International Conference on Electronics, Electrical Engineering and Computing – INTERCON aims to bring together researchers, professionals, students and entrepreneurs to facilitate the approach, identification and commitment to join challenges that allow the development of technologies for the benefit of humanity. |
Call for Papers |
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The topics include, but they are not limited to:
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Summary |
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INTERCON 2020 : IEEE XXVII International Conference on Electronics, Electrical Engineering and Computing will take place in Lima, Peru. It’s a 3 days event starting on Sep 03, 2020 (Thursday) and will be winded up on Sep 05, 2020 (Saturday). INTERCON 2020 falls under the following areas: COMMUNICATION, ALGORITHMS, GRAPHICS, COMPUTING, etc. Submissions for this Conference can be made by Jun 15, 2020. Authors can expect the result of submission by Jul 31, 2020. Upon acceptance, authors should submit the final version of the manuscript on or before Aug 09, 2020 to the official website of the Conference. Please check the official event website for possible changes before you make any travelling arrangements. Generally, events are strict with their deadlines. It is advisable to check the official website for all the deadlines. Other Details of the INTERCON 2020
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Credits and Sources |
| [1] INTERCON 2020 : IEEE XXVII International Conference on Electronics, Electrical Engineering and Computing |
