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2019 IEEE International Conference on Distributed Computing, VLSI, Electrical Circuits and Robotics (DISCOVER), August 11-12, 2019 by IEEE Mangalore Sub-Section at Manipal Institute of Technology, Manipal, Udupi (Karnataka), India
in association with IEEE Bangalore Section
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Submission deadline: April 20, 2019
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CALL FOR PAPERS
The Manipal Institute of Technology, Manipal (Karnataka) is hosting the third IEEE International Conference on Distributed Computing, VLSI, Electrical circuits and Robotics (DISCOVER) Conference Record Number # 47552 . DISCOVER is a flagship conference of IEEE Mangalore sub-Section and financially sponsored by IEEE Bangalore Section. DISCOVER aim to provide an international platform to the students, professionals, practitioners and researchers from industry and academia working in the areas of Distributed Computing, VLSI Verification, Communication Engineering, Electrical Circuits, Robotics and Healthcare. A series of plenary talks, followed by oral and poster presentations and other events have been planned to facilitate networking among the delegates.
The accepted and presented papers in the previous editions of IEEE DISCOVER were published in IEEE Explorer.
The conference details are available at http://www.ieee-discover.org/ . DISCOVER 2019 will be held in the vibrant premises of Manipal Institute of Technology (Institute of Eminence), Manipal, Udupi, Karnataka, India. The paper submission is managed through
EasyChair (https://easychair.org/conferences/?conf=discover2019)
The last date for paper submission is 20th April 2019.
DISCOVER solicits paper submissions across six tracks as listed below. Kindly note that the submissions are not limited to the topics mentioned in each track.
Track 1: Distributed Computing
Multi-core Architecture
Parallel & Distributed Systems
Agent-Based Systems
Autonomic Computing
Mobile & Ubiquitous Computing
Service-Oriented Computing
Scalable Servers and Systems
Intelligent Computing
Secured Computing
GPU Programming
Parallel & Distributed Algorithms
Compiler Technologies for HPC
Peer to Peer Computing
Cloud Computing
Network Storage Systems
High Performance Storage Systems
Edge Computing
Track 2: Communications
Network Algorithms
Network Control & Management
Disaster Recovery of Networks
Cognitive Communications
Wireless Sensor Networks
Software Defined Networks
Future Internet Architecture
Optical Networks
Internet of Things
Network Performance Analysis
QoS for Emergency Applications
Optical Communications
Photonics
Wireless and Mobile Networks
Ad hoc and Mesh Networks
Named Data Networking
LTE and 5G Networks
Body Area Networks
Unmanned Aerial Vehicle Networks
RF and Microwave Engineering
Antenna Engineering
Waveguide and Filter design
Microwave Compatability
Electromagnetic Interference
Microwave Theory and Techniques
Optical Fiber Communications
Track 3: VLSI
VLSI Circuits and Systems
RF Circuit Design and Testing
Emerging Trends in VLSI
Reconfigurable Systems
System on Chip
Heat Dissipation Analysis
Design of MEMS Devices
Optical MEMS Devices
Nanotechnology
Photovoltaics
Analog / Mixed Signals
RF Circuit Analysis
Field Programmable Systems
System Level Design
Physical Design and Testing
Power Awareness Analysis
Design of NEMS Devices
Electrical Packaging / codesign
Thin film and devices
Track 4: Electrical and Electronic Circuits
Electrical AC/DC Circuits
Analog and Digital Circuits
High-speed/low-power circuits
Near and sub-threshold circuits
Nonlinear Circuits & Systems
Neural/fuzzy-logic circuits
Energy efficient systems and circuits
FPGA based systems
Track 5: Robotics
Robotic Technologies
Robots for Industrial Applications
Robots for Domestic Premises
Robots for Education
Robots for Health Care
Robots for Transportation
Robots for Commercial Usage
Humanoids
Track 6: Healthcare
Biomedical Sensors and Wearable Systems
Therapeutic and Diagnostic Systems and Technologies
Biomedical and Health Informatics
Translational Engineering for Healthcare Innovation and Commercialization
Biomedical Signal and Image Processing
Pattern Recognition
Please share this information with the concerned departments in your institution and with your friends. If you need further information, please email your queries to [email protected]
Note- Discount of 50% in the registration fees will be provided for the second accepted paper from the same registered author. Only one registration kit will be given in that case.
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Thanks and regards,
Publicity Chair
IEEE DISCOVER 2019
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