IMPACT SCORE JOURNAL RANKING CONFERENCE RANKING Conferences Journals Workshops Seminars SYMPOSIUMS MEETINGS BLOG LaTeX 5G Tutorial Free Tools
DIKW 2022 : [Call for Papers]: IEEE DIKW 2022 (Hybrid Conference)
DIKW 2022 : [Call for Papers]: IEEE DIKW 2022 (Hybrid Conference)

DIKW 2022 : [Call for Papers]: IEEE DIKW 2022 (Hybrid Conference)

Chengdu, China
Event Date: December 18, 2022 - December 20, 2022
Submission Deadline: September 20, 2022
Notification of Acceptance: October 15, 2022
Camera Ready Version Due: November 10, 2022


Categories



Call for Papers

[Our apologies if you receive multiple copies of this CFP]

++++++++++++++++++++++++++++++++++++++++++++++++++++

The 2022 IEEE International Conference on Data, Information, Knowledge and Wisdom (DIKW-2022)

Chengdu, China

December 18-20, 2022

http://www.ieee-cybermatics.org/2022/dikw/

++++++++++++++++++++++++++++++++++++++++++++++++++++


Dear colleagues/friends,

Hope you are well and healthy. The IEEE DIKW-2022 International Conference on Data, Information, Knowledge and Wisdom was planned to be held at Chengdu, China, December 18-20, 2022. You are cordially invited to submit your latest research results to the IEEE DIKW-2022 Conference:http://www.ieee-cybermatics.org/2022/dikw/


--------------------------------

INTRODUCTION

--------------------------------

Data, Information, Knowledge and Wisdom, in short (DIKW), have been used widely as marking terms in various domains for expressing and exchanging semantic or conceptual subjective or objective understandings. However, there are still no unified understandings over the meaning of the DIKW concepts. Data, Information, Knowledge, and Wisdom as a whole concept of DIKW is also missing unified understandings of the relationships among them. Therefore, there have been proposals and models of DIKW as “layered hierarchy”, “architecture”, “framework”, “network”,“thinking mode”,“pattern”,“style”,“theory”,“methodology”,“model”,“graph”, etc.



IEEE DIKW-2022 Conference is co-organized by Sichuan Association for Science and Technology and the DIKW research group of Sichuan University, aims to bring together scientists, researchers, and industrial engineers to exchange experimental and theoretical Data/ Information/Knowledge/Wisdom modeling and processing results, novel designs, explainable AI, AI governance, work-in-progress and case studies on theories, design mechanisms and extensions on DIKW transformations and interactions in all areas, in all phases, empirical or theoretical solutions. IEEE DIKW-2022 is sponsored by IEEE, IEEE Computer Society, and IEEE Technical Committee on Scalable Computing (TCSC). In view of all considerations, this conference will be held together with 5 other high-quality conferences. The specific conference titles and related links are listed below:

The 23rd IEEE International Conference on High Performance Computing and Communications (HPCC-2022): http://www.ieee-hpcc.org/2022/
The 8th IEEE International Conference on Data Science and Systems (DSS-2022): http://www.ieee-cybermatics.org/2022/dss/
The 18th IEEE International Conference on Embedded Software and Systems (ICESS-2022): http://www.ieee-cybermatics.org/2022/icess/
The 20th IEEE International Conference on Smart City (Smart City-2022): http://www.ieee-cybermatics.org/2022/smartcity/
The 8th IEEE International Conference on Dependability in Sensor, Cloud & Big Data Systems & Applications (DependSys-2022): http://www.ieee-cybermatics.org/2022/dependsys/
We hope you will join us for the great gathering and look forwards to seeing you in the beautiful city Chengdu!


-----------------------------------------------

SCOPE AND TOPICS

-----------------------------------------------

This conference will focus on (but not limited to) the following topics:
- Theories, Algorithms and Platforms for Data Analytics and Information Retrieving
- Data Provenance, Cleaning, Curation and Governance Services
- Data, Information, Knowledge and Wisdom Sharing, Integration and Migration
- Real-time Data Modeling and Information Provision Services and Applications
- Data-driven Intelligent Decision-making and Innovative Applications
- Goal or Purpose Models, Techniques and Tools for Smart Computing
- Data Models, Information Semantics, Query languages
- Data Stream Systems and Sensor Networks
- Data Visualization and Interactive Data Exploration
- Hybrid AI Privacy, Security, Trust, and Responsibility Provision
- Data-Knowledge Mixed Processing Systems and Service Architecture
- Domain Knowledge Modeling and Ontology-Building
- Data, Information and Knowledge Transformation Load balance
- DIKW content Storage and Retrieval and Interface Technology
- Software Tools for Data-Information-Knowledge Quality Modeling and Testing
- Computational Intelligence for Data, Information and Knowledge Hybrid Systems
- Multimedia and Cross-modals "Databases" Processing
- Development and Management of Heterogeneous Knowledge Bases
- Knowledge Extraction, Discovery, Analysis and Representation
- Application of Knowledge Representation Techniques to Semantic Modeling
- Optimization Techniques of DIKW applications
- Theories of DIKW Models and Performance Evaluation Approach



-------------------------------------

SUBMISSION GUIDELINES

-------------------------------------

http://www.ieee-cybermatics.org/2022/dikw/call4paper.html

----------------------------

IMPORTANT DATES

----------------------------

Special Session: Jun. 30, 2022

Paper Submission Deadline: Sep. 01, 2022

Author Notification: Oct. 15, 2022

Final Manuscript Due: Nov. 10, 2022


-------------------------------------

ORGANIZING COMMITTEE

-------------------------------------

General Chairs
Xifan Yao, South China Univ. of Tech., China
Riccardo Martoglia, FIM – Univ. of Modena, Italy
Junzhi Yu, Peking Univ., China


Steering Committee
Laurence T. Yang, Hainan Univ., China (Chair)
Yucong Duan, Hainan Univ., China (Chair)
Wei Liu, Beijing Univ. of Posts and Telecom., China
Carl Chang, Iowa State Univ., USA

Program Chairs
Jing Yang, Hainan Univ., China
Yuan Gao, Hainan Univ., China

Program Vice-Chairs
Miao Li, Nat. Univ. of Def. Tech., China
Qian Qiu, Henan Univ., China

Publicity Chairs
Li Liu, Univ. of Pittsburgh, USA
Dongyu Xin, Huazhong Univ. of Sci. and Tech., China
Hao Wang, Huazhong Univ. of Sci. and Tech., China

Web Chairs
JiaWei Wang, St. Francis Xavier Univ., Canada
Tinghua Zhang, Hainan Univ., China



Best Regards!

-------------------------------------


Summary

DIKW 2022 : [Call for Papers]: IEEE DIKW 2022 (Hybrid Conference) will take place in Chengdu, China. It’s a 3 days event starting on Dec 18, 2022 (Sunday) and will be winded up on Dec 20, 2022 (Tuesday).

DIKW 2022 falls under the following areas: etc. Submissions for this Conference can be made by Sep 20, 2022. Authors can expect the result of submission by Oct 15, 2022. Upon acceptance, authors should submit the final version of the manuscript on or before Nov 10, 2022 to the official website of the Conference.

Please check the official event website for possible changes before you make any travelling arrangements. Generally, events are strict with their deadlines. It is advisable to check the official website for all the deadlines.

Other Details of the DIKW 2022

  • Short Name: DIKW 2022
  • Full Name: [Call for Papers]: IEEE DIKW 2022 (Hybrid Conference)
  • Timing: 09:00 AM-06:00 PM (expected)
  • Fees: Check the official website of DIKW 2022
  • Event Type: Conference
  • Website Link: http://www.ieee-cybermatics.org/2022/dikw/
  • Location/Address: Chengdu, China


Credits and Sources

[1] DIKW 2022 : [Call for Papers]: IEEE DIKW 2022 (Hybrid Conference)


Check other Conferences, Workshops, Seminars, and Events