Categories |
COMPUTER ARCHITECTURE
MICROARCHITECTURE
SOFTWARE
VLSI
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About |
IEEE COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 24 is to be held in Tokyo on April 14-16, 2021. |
Call for Papers |
Contributions are solicited in the following areas:
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Summary |
COOL Chips 24 2021 : IEEE Symposium on Low-Power and High-Speed Chips and Systems will take place in Bunkyo-ku, Tokyo, Japan. It’s a 3 days event starting on Apr 14, 2021 (Wednesday) and will be winded up on Apr 16, 2021 (Friday). COOL Chips 24 2021 falls under the following areas: COMPUTER ARCHITECTURE, MICROARCHITECTURE, SOFTWARE, VLSI, etc. Submissions for this Symposium can be made by Feb 05, 2021. Authors can expect the result of submission by Mar 12, 2021. Upon acceptance, authors should submit the final version of the manuscript on or before Mar 26, 2021 to the official website of the Symposium. Please check the official event website for possible changes before you make any travelling arrangements. Generally, events are strict with their deadlines. It is advisable to check the official website for all the deadlines. Other Details of the COOL Chips 24 2021
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Credits and Sources |
[1] COOL Chips 24 2021 : IEEE Symposium on Low-Power and High-Speed Chips and Systems |