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CODES+ISSS 2022 : International Conference on Hardware/Software Codesign and System Synthesis
CODES+ISSS 2022 : International Conference on Hardware/Software Codesign and System Synthesis

CODES+ISSS 2022 : International Conference on Hardware/Software Codesign and System Synthesis

Hybrid-Shanghai
Event Date: October 07, 2022 - October 14, 2022
Abstract Submission Deadline: March 31, 2022
Submission Deadline: April 07, 2022
Notification of Acceptance: July 05, 2022




Call for Papers

=========================================================================
CODES+ISSS 2022
Call for Papers
International Conference on
Hardware/Software Codesign and System Synthesis
October 07 – October 14, 2022, Hybrid-Shanghai
=========================================================================

The International Conference on Hardware/Software Codesign and System
Synthesis (CODES+ISSS) is the premier conference in system-level design,
hardware/software co-design, modeling, analysis, and implementation of
modern Embedded Systems, Cyber-Physical Systems, and Internet-of-Things,
from system-level specification and optimization to system synthesis of
multi-processor hardware/software implementations. CODES+ISSS is part of
Embedded Systems Week (ESWEEK), the premier event covering all aspects
of hardware and software design for smart, intelligent and connected
computing systems.

https://esweek.org/codesisss-call-for-papers-page/

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Timeline
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Journal-Track Submissions
- Abstracts: March 31, 2022 (AoE, Firm)
- Full Papers: April 7, 2022 (AoE, Firm)

Work-in-Progress Submissions
- June 11, 2022 (AoE, Firm)

Notification of Acceptance
- July 5, 2022 (both tracks)

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Topics of Interests / Tracks
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Track 1: System-level design – Specification, modeling, refinement,
synthesis, and partitioning of embedded systems, hardware-software
co-design, hybrid system modeling and design, model-based design,
design for adaptivity and reconfigurability.

Track 2: Domain and application-specific design – Analysis, design,
and optimization techniques for multimedia, medical, automotive,
cyber-physical, IoT, and other application domains.

Track 3: System architecture – Heterogeneous systems, many-cores,
and distributed systems, architecture and micro-architecture design,
exploration and optimizations of application-specific processors and
accelerators, reconfigurable and self-adaptive architectures, storage,
memory systems, and networks-on-chip.

Track 4: Simulation, validation, and verification – Hardware/software
co-simulation, verification, and validation methodologies, formal
verification, hardware-accelerated simulation, simulation, and
verification languages, models, and benchmarks.

Track 5: Embedded software – Language and library support, compilers,
runtimes, parallelization, software verification, memory management,
virtual machines, operating systems, real-time support, middleware.

Track 6: Safety, security, and reliability – Cross-layer reliability,
resiliency and fault tolerance, test methodology, design for security,
reliability, and testability, hardware security, security for embedded,
CPS, and IoT devices.

Track 7: Power-aware systems – Power-aware and energy-aware system
design and methodologies, ranging from low-power embedded and cyber-
physical systems, IoT devices, to energy-efficient large-scale systems
such as cloud datacenters, green computing, and smart grids.

Track 8: Embedded machine learning – Hardware and software design,
implementation, and optimization for machine learning that are
specially designed for resource- and power-constrained embedded,
CPS, and IoT devices.

Track 9: Industrial practices and case studies – Practical impact on
current and/or future industries, application of state-of-the-art
methodologies and tools in areas including wireless, networking,
multimedia, automotive, cyber-physical, medical systems, IoT, etc.

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Journal-Integrated Publication Model
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CODES+ISSS 2022 solicits the submission of original research articles in
two categories, i) full-length research papers that will be published in
the IEEE Transactions on Computer-Aided Design of Integrated Circuits
and Systems (TCAD), and ii) short Work-in-Progress papers that will be
published in the CODES+ISSS Proceedings. For both categories, CODES+ISSS
solicits submission on the following topics. More information about the
submission is at https://www.esweek.org/author-information.

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Organization
-------------------------------------------------------------------------
CODES+ISSS Program Chairs:
Chengmo Yang, University of Delaware, US
Mohammad Al Faruque, University of California, Irvine, US

ESWEEK General Chairs:
Aviral Shrivastava, Arizona State University, US
Xiaobo Sharon Hu, General Co-Chair, University of Notre Dame, US

www.esweek.org


Summary

CODES+ISSS 2022 : International Conference on Hardware/Software Codesign and System Synthesis will take place in Hybrid-Shanghai. It’s a 8 days event starting on Oct 7, 2022 (Friday) and will be winded up on Oct 14, 2022 (Friday).

CODES+ISSS 2022 falls under the following areas: EMBEDDED SYSTEMS, SYSTEM ARCHITECTURE, SIMULATION, EMBEDDED SOFTWARE, etc. Submissions for this Conference can be made by Apr 7, 2022. Authors can expect the result of submission by Jul 5, 2022.

Please check the official event website for possible changes before you make any travelling arrangements. Generally, events are strict with their deadlines. It is advisable to check the official website for all the deadlines.

Other Details of the CODES+ISSS 2022

  • Short Name: CODES+ISSS 2022
  • Full Name: International Conference on Hardware/Software Codesign and System Synthesis
  • Timing: 09:00 AM-06:00 PM (expected)
  • Fees: Check the official website of CODES+ISSS 2022
  • Event Type: Conference
  • Website Link: https://esweek.org/codes-isss/
  • Location/Address: Hybrid-Shanghai


Credits and Sources

[1] CODES+ISSS 2022 : International Conference on Hardware/Software Codesign and System Synthesis


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