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Material Science Events in July

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ICMSET 2024 : 2024 the 13th International Conference on Material Science and Engineering Technology (ICMSET 2024)

 Nagoya, Japan
When: Nov 22, 2024 - Nov 24, 2024 Submission Deadline: Jul 10, 2024
Full Name: 2024 the 13th International Conference on Material Science and Engineering Technology (ICMSET 2024) • Abbreviation: ICMSET 2024 • Nagoya, Japan (Nagoya Convention Hall) | Novem...
MATERIALS SCIENCE   ENGINEERING   NANOTECHNOLOGY   MANUFACTURING  

ICMSET--SCOPUS, Ei 2022 : 2022 11th International Conference on Material Science and Engineering Technology (ICMSET 2022)--SCOPUS, Ei Compendex

 Tokyo, Japan
When: Nov 26, 2022 - Nov 28, 2022 Submission Deadline: Jul 5, 2022
Full Name: 2022 11th International Conference on Material Science and Engineering Technology (ICMSET 2022)--SCOPUS, Ei Compendex • Abbreviation: ICMSET 2022 • Tokyo, Japan | November 26-2...
MATERIALS SCIENCE   INDUSTRIAL ENGINEERING   SYSTEMS ENGINEERING   MECHANICAL ENGINEERING  



ICMSET--SCOPUS, Ei Compendex 2022 : 2022 11th International Conference on Material Science and Engineering Technology (ICMSET 2022)--SCOPUS, Ei Compendex

 Tokyo, Japan
When: Nov 26, 2022 - Nov 28, 2022 Submission Deadline: Jul 5, 2022
Full Name: 2022 11th International Conference on Material Science and Engineering Technology (ICMSET 2022)--SCOPUS, Ei Compendex • Abbreviation: ICMSET 2022 • Tokyo, Japan | November 26-2...
MATERIALS   ENGINEERING   MANUFACTURING   NANOTECHNOLOGY  

ICEMSEE 2022 : 3rd International Conference on Energy, Material Science and Environment Engineering

 Wuhan, China
When: Aug 19, 2022 - Aug 21, 2022 Submission Deadline: Jul 31, 2022
Scopes • The conferences looks for submissions included but not limited to followings topics: • Topic 1: Energy • Modelling of Thermal and Energy Systems • Research and Applic...
ENERGY   MATERIAL SCIENCE   ENVIRONMENT ENGINEERING   AIR POLLUTION CONTROL  

ICIMA 2019 : Scopus-Indexed AIP International Conference on Inventive Material Science Applications

 PPG Institute of Technology
When: Sep 25, 2019 - Sep 26, 2019 Submission Deadline: Jul 25, 2019
Iron & Steel Classes and Standards, • Iron & Steel Manufacturing Methods and New Approaches, • Refractories in Iron & Steel Industry, • Fracture and Fatigue Behavior of Iron & Steel,...
METALLURGY AND MATERIALS   POWDER METALLURGY   FORMING & MACHINING   ADVANCED CERAM?CS  

31 July 2019 : [Materials IF 2.467] Special Issue Materials for Photolithography and 3D Printing

 N/A
Submission Deadline: Jul 31, 2019
Dear Colleagues, • Photolithography (PL) is a well-established optical means for transferring patterns onto a substrate. First conceived for producing printed circuits, it is a key process in th...
MATERIALS   MATERIAL SCIENCE   POLYMERS   CHEMISTRY  

1 July 2019 : Special Issue of Radiation Damage in Materials Helium Effects

 N/A
Submission Deadline: Jul 1, 2019
Dear Colleagues, • Understanding radiation damage effects in materials, used in various irradiation environments, has been an ongoing challenge for several decades. The complexity stems from the...
MATERIALS   MATERIAL SCIENCE   PHYSICS   NUCLEAR  

CMA 2019 : 2019 International Conference on Metals and Alloys

 Beijing, China
When: Aug 19, 2019 - Aug 22, 2019 Submission Deadline: Jul 25, 2019
The 2019 International Conference on Metals and Alloys (CMA 2019) will be held from August 19 to 22 in Beijing, China. The overall objective of the conference is to bring together international scient...
MATERIAL SCIENCE   METALS   ALLOYS  

CETCS 2019 : International Conference on Contemporary Issues in Engineering, Technology and Computer Sciences (CETCS-JULY-2019)

 The Federal Kuala Lumpur Malaysia
When: Jul 13, 2019 - Jul 14, 2019 Submission Deadline: Jun 20, 2019
The invited talk proposals can be submitted to [email protected] • The objective of GIEAS Forum is to provide a platform for researchers, engineers, academicians as well as industrial professional...
FUNDAMENTAL AND APPLIED SCIENC   MATERIAL SCIENCE AND ENGINEERI   ELECTRICAL AND ELECTRONIC ENGI   COMPUTER ENGINEERING AND SCIEN  




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