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When: Jun 25, 2024 - Jun 28, 2024 Submission Deadline: Feb 29, 2024 | ||
The International Symposium on Statistics and Machine Learning in Electronics, • in the framework of the 9th International Conference on Smart and Sustainable • Technologies (SpliTech 202... | ||
MACHINE LEARNING STATISTICS CIRCUIT ANALYSIS AND DESIGN ELECTRONICS | ||
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When: Mar 14, 2024 - Mar 15, 2024 Submission Deadline: Feb 20, 2024 | ||
The 4th International Symposium on Intelligence Design (ISID 2024) is an international conference for researchers from various research fields to discuss the potential future of artificial intelligen... | ||
COMPUTER GRAPHICS DESIGN HCI ARTIFICIAL INTELLIGENCE | ||
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When: May 10, 2024 - May 13, 2024 Submission Deadline: Feb 10, 2024 | ||
★Full Name: International Symposium of EDA 2024 (ISEDA 2024) • ★Abbreviation: ISEDA 2024 • Date: May 10-13, 2024 • Website: https://www.eda2.com/iseda/index.html • Venue: ... | ||
SYSTEMS ENGINEERING DESIGN SOFTWARE ENGINEERING ARTIFICIAL INTELLIGENCE | ||
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Submission Deadline: Feb 29, 2024 | ||
================================== • MDPI Machines Special Issue: Flexible Tactile Sensor Array: Trends and Applications • Paper Submission Deadline: 29 February 2024 • https://www.... | ||
TACTILE SENSOR FLEXIBLE SENSOR TACTILE SENSOR DESIGN DATA PROCESSING | ||
ICMDA 2024 : 2024 7th International Conference on Materials Design and Applications (ICMDA 2024)Tokyo Institute of Technology, Japan |
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When: Apr 9, 2024 - Apr 12, 2024 Submission Deadline: Feb 5, 2024 | ||
* Full Name: 2024 7th International Conference on Materials Design and Applications (ICMDA 2024) • * Abbreviation: ICMDA 2024 • * Conference Venue: Tokyo Institute of Technology, Japan &... | ||
MATERIALS SCIENCE MANUFACTURING MECHANICAL ENGINEERING NANOTECHNOLOGY | ||
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When: Feb 24, 2024 - Feb 25, 2024 Submission Deadline: Jan 13, 2024 | ||
5th International Conference on Signal Processing, VLSI Design & Communication Systems (SVC 2024)February 24 ~ 25, 2024, Vancouver, CanadaTopics of interest include, but are not limited to, the follow... | ||
SIGNAL PROCESSING IMAGE PROCESSING VLSI ROBOTICS | ||
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When: Mar 24, 2023 - Mar 26, 2023 Submission Deadline: Feb 15, 2023 | ||
☆☆ MatDes 2023 - Ei Compendex, Scopus Index ☆☆ • Full name: 2023 The 5th International Workshop on Materials and Design (MatDes 2023) • Abbreviation: MatDes 2023 • Website�... | ||
MATERIALS SCIENCE INDUSTRIAL ENGINEERING MECHANICAL ENGINEERING NANOTECHNOLOGY | ||
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When: Mar 24, 2023 - Mar 26, 2023 Submission Deadline: Feb 15, 2023 | ||
☆☆ MatDes 2023 - Ei Compendex, Scopus Index ☆☆ • Full name: 2023 The 5th International Workshop on Materials and Design (MatDes 2023) • Abbreviation: MatDes 2023 • Website�... | ||
MATERIALS DESIGN ENGINEERING MANUFACTURING | ||
ICCMC 2023 : 7th International Conference on Computing Methodologies and CommunicationSurya Engineering College, Erode, India. |
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When: Feb 23, 2023 - Feb 25, 2023 Submission Deadline: Nov 30, 2022 | ||
Cloud Based Communication • Cloud-Based Multimedia Content Sharing Network • Advanced Network Architecture Design for Cloud-Based Multimedia Delivery • Cooperative Schemes for Cloud... | ||
CLOUD BASED COMMUNICATION COMPUTING IN HEALTHCARE INTELLIGENT COMPUTING SYSTEMS VLSI DESIGN AND AUTOMATION | ||
ISID 2022 : 2nd International Symposium on Intelligence DesignOnline (Tokyo, JAPAN) |
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When: Mar 14, 2022 - Mar 15, 2022 Submission Deadline: Feb 28, 2022 | ||
2nd International Symposium on Intelligence Design (ISID 2022) is an international conference for researchers from various research fields to discuss about the potential future of artificial intellig... | ||
ARTIFICIAL INTELLIGENCE COMPUTER GRAPHICS COMPUTER VISION HUMAN COMPUTER INTERACTION | ||
SPM 2022 : Solid and Physical ModelingSingapore (online) |
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When: Jun 27, 2022 - Jun 29, 2022 Submission Deadline: Feb 17, 2022 | ||
The Symposium on Solid and Physical Modeling (SPM) is an international conference series organised annually with the support of the Solid Modeling Association (SMA). The conference aims at all aspect... | ||
COMPUTER SCIENCE GEOMETRY MODELING PHYSICS-BASED MODELING COMPUTER-AIDED DESIGN | ||
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When: May 3, 2022 - May 3, 2022 Submission Deadline: Feb 1, 2022 | ||
ACM/IEEE DESTION 2022 CALL FOR PAPERS • The 4th Workshop on Design Automation for CPS and IoT • May 3, 2022, part of CPS-IoT Week 2022 • https://cps-vo.org/group/DESTION22 • O... | ||
CPS IOT AI MACHINE LEARNING | ||
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When: Jun 29, 2021 - Jul 01, 2021 Submission Deadline: Feb 22, 2021 | ||
Reconfigurable computing technologies offer the promise of substantial performance gains over traditional architectures via customizing the topology of the underlying architecture to match the specifi... | ||
RECONFIGURABLE COMPUTING DESIGN | ||
DATE 2021 : Design, Automation and Test in Europe ConferenceGrenoble, France |
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When: Feb 01, 2021 - Feb 05, 2021 Submission Deadline: Sep 21, 2020 | ||
The 24th DATE conference and exhibition is the main European event bringing together designers and design automation users, researchers and vendors, as well as specialists in the design, test and manu... | ||
DESIGN AUTOMATION | ||
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When: Feb 25, 2021 - Feb 27, 2021 Submission Deadline: Aug 30, 2020 | ||
6th International Conference on Design Engineering and Science (ICDES 2021) is organzied by Hong Kong Society of Mechanical Engineers(HKSME), technical sponsored by Loughborough University, Gent Unive... | ||
DESIGN MANUFACTURING MECHANICAL ENGINEERING DESIGN AUTOMATION | ||
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Submission Deadline: Feb 14, 2020 | ||
International Journal of Electronic Design and Test(JEDT) is a peer-reviewed, open access journal which invites original works describing the methods used to design and test electronic product hardwar... | ||
ELECTRONICS ENGINEERING DESIGN AUTOMATION SIGNAL PROCESSING CIRCUITS | ||
ISVLSI 2020 : IEEE Computer Society Annual Symposium on VLSILimassol, CYPRUS |
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When: Jul 06, 2020 - Jul 08, 2020 Submission Deadline: Feb 20, 2020 | ||
ISVLSI 2020 explores emerging trends and novel ideas and concepts in the area of VLSI. The symposium covers a range of topics: from VLSI circuits, systems and design methods to system-level design and... | ||
VLSI SYSTEMS AND DESIGN SYSTEM LEVEL DESIGN SOC ISSUES | ||
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When: Feb 16, 2020 - Feb 18, 2020 Submission Deadline: Oct 1, 2019 | ||
2020 The 6th International Conference on Mechanical Design and Engineering (ICMDE 2020)--JA, Scopus • Sanya, China February 16-18, 2020 • http://www.icmde.org/ • Dear Scholars and Re... | ||
MECHANICAL ENGINEERING DESIGN ENGINEERING ROBOTICS | ||
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When: Feb 27, 2020 - Feb 28, 2020 Submission Deadline: Sep 30, 2019 | ||
Call for Abstracts (Due by 30 September 2019) • Abstract Submission link: https://easychair.org/conferences/?conf=icsde2020 • ============================================= • We are i... | ||
SUSTAINABILITY ENVIRONMENTAL CONSERVATION SUSTAINABLE DESIGN GREEN INFRASTRUCTURE | ||
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When: Feb 26, 2020 - Feb 28, 2020 Submission Deadline: Jan 11, 2020 | ||
Cryptography, • High Speed Networks, • Mobile Computing, • Mobile Networks & Wireless LAN, • Optical Networking, • Network Based Applications, • Network Security, ... | ||
DATA COMMUNICATION AND COMPUTE SOFTWARE ENGINEERING MACHINE LEARNING AND OPTIMIZAT VLSI DESIGN AND AUTOMATION | ||
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When: May 1, 2019 - Feb 20, 2020 Submission Deadline: Dec 31, 2019 | ||
In modern pharmaceutical companies, in-silico drug discovery has become a promising • solution for finding new drugs or detecting potential targets of preselected biomolecules. The process of dr... | ||
DRUG DISCOVERY CANCER DIAGNOSES DRUG DESIGN CANCER PROGNOSIS | ||
ICBMC--EI and Scopus 2020 : 2020 5th International Conference on Building Materials and Construction (ICBMC 2020)--Ei Compendex, ScopusTokyo University of Science, Japan |
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When: Feb 26, 2020 - Feb 29, 2020 Submission Deadline: Oct 5, 2019 | ||
2020 5th International Conference on Building Materials and Construction (ICBMC 2020) will be held during February 26-29, 2020 in Tokyo University of Science, Japan. • Main Attractions: • ... | ||
MATERIALS ARCHITECTURE DESIGN ENGINEERING | ||
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When: Feb 26, 2020 - Feb 29, 2020 Submission Deadline: Sep 30, 2019 | ||
2020 The 3rd Internationalal Conference on Automation, Mechanical and Design Engineering (ICAMD 2020)--EI Compendex, Scopus • Bangkok, Thailand • February 26-29, 2020 • More details,... | ||
ROBOTICS CONTROL ARTIFICIAL INTELLIGENCE SYSTEM ENGINEERING | ||
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When: Feb 26, 2020 - Feb 29, 2020 Submission Deadline: Sep 30, 2019 | ||
2020 The 3rd Internationalal Conference on Automation, Mechanical and Design Engineering (ICAMD 2020)--EI Compendex, Scopus • Bangkok, Thailand • February 26-29, 2020 • More details,... | ||
AUTOMATION MECHANICAL ENGINEERING DESIGN ENGINEERING | ||
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When: Feb 27, 2020 - Feb 29, 2020 Submission Deadline: Oct 10, 2019 | ||
Call for Papers • 5th International Conference on Design Engineering and Science (ICDES 2020) • 27-29, Feb, 2020./Shenzhen, China • Web: http://www.icdes.org/ • 2020 5th Intern... | ||
ENGINEERING DESIGN MECHANICAL SCIENCE | ||
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When: Feb 15, 2020 - Feb 17, 2020 Submission Deadline: Sep 25, 2019 | ||
Welcome to join in the 2020 4th European Conference on Design, Modeling and Optimization (ECDMO 2020), which will be held in Athens, Greece during February 15-17, 2020. • For papers submitted ... | ||
DESIGN MODELING OPTIMIZATION SYSTEM ENGINEERING | ||
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When: Feb 9, 2020 - Feb 12, 2020 Submission Deadline: Aug 10, 2019 | ||
TEI2020 is the 14th annual conference dedicated to presenting the latest results in tangible, embedded, and embodied interaction. The ACM-TEI conference has gained substantial visibility and activity ... | ||
DESIGN INTERACTION DESIGN TANGIBLE INTERACTION EMBODIMENT | ||
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When: Feb 25, 2020 - Feb 27, 2020 Submission Deadline: Sep 19, 2019 | ||
NSDI '20 Call for Papers • Sponsored by USENIX, the Advanced Computing Systems Association. • The 17th USENIX Symposium on Networked Systems Design and Implementation (NSDI '20) will be co... | ||
COMPUTER NETWORKS CLOUD WIRELESS NFV | ||
Find and Compare Upcoming Design Events in February. Check Important Dates, Venue, Speaker, Location, Address, Exhibitor Information, Timing, Schedule, Discussion Topics, Agenda, Visitors Profile, and Other Important Details.