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INTERCON 2020 : IEEE XXVII International Conference on Electronics, Electrical Engineering and Computing
INTERCON 2020 : IEEE XXVII International Conference on Electronics, Electrical Engineering and Computing

INTERCON 2020 : IEEE XXVII International Conference on Electronics, Electrical Engineering and Computing

Lima, Peru
Event Date: September 03, 2020 - September 05, 2020
Submission Deadline: June 15, 2020
Notification of Acceptance: July 31, 2020
Camera Ready Version Due: August 09, 2020




About

The 2020 IEEE XXVII International Conference on Electronics, Electrical Engineering and Computing – INTERCON aims to bring together researchers, professionals, students and entrepreneurs to facilitate the approach, identification and commitment to join challenges that allow the development of technologies for the benefit of humanity.


Call for Papers

The topics include, but they are not limited to:

  • Communication systems
  • Semiconductor and devices
  • Computers and information technology
  • Signal processing
  • Systems and control
  • Emerging technologies
  • Circuits and systems
  • Power generation, transmission and distribution
  • Renewable energy sources, smartgrids technologies and applications
  • Power electronics, systems and applications
  • Electrical machines and adjustable speed drives
  • High voltage engineering and insulation technology
  • Algorithms and complexity
  • Architecture and organization
  • Graphics and visualization
  • Information management, assurance and security
  • Intelligent systems
  • Parallel and distributed Computing
  • Software engineering
  • Social issues and professional practice


Summary

INTERCON 2020 : IEEE XXVII International Conference on Electronics, Electrical Engineering and Computing will take place in Lima, Peru. It’s a 3 days event starting on Sep 03, 2020 (Thursday) and will be winded up on Sep 05, 2020 (Saturday).

INTERCON 2020 falls under the following areas: COMMUNICATION, ALGORITHMS, GRAPHICS, COMPUTING, etc. Submissions for this Conference can be made by Jun 15, 2020. Authors can expect the result of submission by Jul 31, 2020. Upon acceptance, authors should submit the final version of the manuscript on or before Aug 09, 2020 to the official website of the Conference.

Please check the official event website for possible changes before you make any travelling arrangements. Generally, events are strict with their deadlines. It is advisable to check the official website for all the deadlines.

Other Details of the INTERCON 2020

  • Short Name: INTERCON 2020
  • Full Name: IEEE XXVII International Conference on Electronics, Electrical Engineering and Computing
  • Timing: 09:00 AM-06:00 PM (expected)
  • Fees: Check the official website of INTERCON 2020
  • Event Type: Conference
  • Website Link: https://www.intercon.org.pe/2020/
  • Location/Address: Lima, Peru


Credits and Sources

[1] INTERCON 2020 : IEEE XXVII International Conference on Electronics, Electrical Engineering and Computing


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