IEEE MMSP 2020 will be held on September 21-23, 2020 in the vibrant city of Tampere, Finland. Tampere is known for its active science and business community, nice location on a scenic spot between two great lakes, and world-class services for its citizens and visitors. It is a lively city, which welcomes millions of congress goers every year. Tampere is easily reachable by air, train and car and offers excellent hosting for any budget. The workshop is 22nd in the series, organized by the Multimedia Signal Processing Technical Committee of the IEEE Signal Processing Society (SPS), with the aim to bring together researchers and practitioners from academia and industry, passionate about multimedia signal processing, to share their knowledge, exchange ideas, explore future research directions and network. Prospective authors are invited to submit regular and special session papers (full length, 4-6 pages) and demo papers (1 page). All accepted papers will be included in the IEEE Xplore and indexed by Scopus and EI. Papers are solicited in, but not limited to, the following areas: Image / video compression Image / video restoration and processing Machine listening for analysis of acoustic scenes Speech / music / audio processing Sound source localization and separation Multimedia communications and networking Multimedia quality assessment Internet of Things (IoT)-based multimedia systems and applications Multimedia hardware design Multimedia databases and digital libraries Multimedia security and forensics Multimedia interaction Multimedia big data analytics Deep Learning for Multimedia Multimedia processing for tele-medicine and health care Augmented, mixed and virtual reality Multimedia systems for emerging applications Tentative Timeline Special Session/Workshop proposal submission – early April, 2020 Regular paper submission – mid May, 2020 Notification of paper acceptance – mid July, 2020 Camera-ready paper submission – late July, 2020 Demo paper submission – mid August, 2020 General chairs: Atanas Gotchev, Tampere University, Finland Dong Tian, InterDigital, USA
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