15 May 2019 : Special Issue of Advanced Materials for Power Electronics

Dear Colleagues,

Materials are fundamental to the field of power electronics, which relies on semiconductor devices (diodes and transistors) and other electrical components (resistors, capacitors, inductors, and transformers) to control the flow of electrical power. Power electronics researchers are constantly driven to improve the efficiency, power density, and reliability of power electronics converters through incremental advances in device, component, and converter integration technologies. However, breakthrough technologies in the field are enabled by innovative developments in materials. For example, it is the advancement made in the crystal growth of gallium nitride (GaN) on silicon that brought a new excitement in the field and has led to a large number of research activities on GaN-based power electronics converters.

The aim of this Special Issue on “Advanced Materials for Power Electronics” is to capture recent developments in all types of materials for advancing power electronics. These developments include wide bandgap semiconductors for devices, dielectrics for capacitors, soft magnetic materials for inductors and transformers, interconnect and encapsulation materials for packaging, thermal interface materials for cooling, and feedstock materials of additive manufacturing for power electronics packaging and integration. Manuscripts in the form of full research papers, communications, and review articles are encouraged.

This issue will provide an in-depth review of the current work in advanced materials for power electronics, and also point to emerging and future research directions. I look forward to your contribution in this Special Issue.

Prof. Dr. Guoquan Lu
Guest Editor

Keywords

wide band-gap semiconductor materials for power devices
dielectrics for power electronics capacitors
soft magnetic materials for power inductors and transformers
die-attach, interconnect, and encapsulation materials for power packaging
thermal interface materials for cooling
feedstock materials of additive manufacturing for heterogeneous integration

Submission steps:

1. Register via our system https://susy.mdpi.com/ and login;

2. Click "Submit to Special Issue" at: https://www.mdpi.com/journal/materials/special_issues/materials_power_electronics

We will highly appreciate it if you can forward the message to your colleagues. We look forward to hearing from you. Have a nice day!