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COOL Chips 24 2021 : IEEE Symposium on Low-Power and High-Speed Chips and Systems

Bunkyo-ku, Tokyo, Japan

Event Date:	Apr 14, 2021 - Apr 16, 2021
Submission Deadline:	Feb 05, 2021
Notification of Acceptance:	Mar 12, 2021
Camera Ready Version Due :	Mar 26, 2021

About

IEEE COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 24 is to be held in Tokyo on April 14-16, 2021.

Call For Paper

Contributions are solicited in the following areas:

Low Power-High Performance Processors for AI, IoT, Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Automotive, Networking, Medical, Healthcare, and Biometrics.
Novel Architectures and Schemes for Single Core, Multi/Many-Core, NoC, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing, GALS and 3D Integration.
Cool Software including Parallel Schedulers, Embedded Real-time Operating System, Binary Translations, Compiler Issues and Low Power Application Techniques.

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Credits and Sources

[1] COOL Chips 24 2021 : IEEE Symposium on Low-Power and High-Speed Chips and Systems

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