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2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 - Impact Factor, Overall Ranking, h-index, SJR, Rating, Publisher, ISSN, and other Important Metrics


Impact Factor

0.76

H-Index

4

Rank

19875

SJR

0.169

Note: The impact factor shown here is equivalent to citescore and is, therefore, used as a replacement for the same. Citescore is produced by Scopus, and can be a little higher or different compared to the impact factor produced by Journal Citation Report. Please refer to Web of Science data source for checking the exact journal impact factor ™ (Thomson Reuters) metric.

Title 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017
Publication Type conference and proceedings
Subject Area, Categories, Scope Instrumentation; Management, Monitoring, Policy and Law; Signal Processing; Urban Studies
h-index 4
Overall Rank/Ranking 19875
SCImago Journal Rank (SJR) 0.169
Impact Factor 0.76
Publisher
Country United States
ISSN 00002017



About 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017


2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 is a conference and proceedings covering the technologies/fields/categories related to Instrumentation; Management, Monitoring, Policy and Law; Signal Processing; Urban Studies. It is published by . The overall rank of 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 is 19875. According to SCImago Journal Rank (SJR), this conference and proceedings is ranked 0.169. SCImago Journal Rank is an indicator, which measures the scientific influence of journals. It considers the number of citations received by a journal and the importance of the journals from where these citations come. SJR acts as an alternative to the Journal Impact Factor (or an average number of citations received in last 2 years). This conference and proceedings has an h-index of 4. The best quartile for this conference and proceedings is -.

The ISSN of 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 conference and proceedings is 00002017. An International Standard Serial Number (ISSN) is a unique code of 8 digits. It is used for the recognition of journals, newspapers, periodicals, and magazines in all kind of forms, be it print-media or electronic. 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 is cited by a total of 69 articles during the last 3 years (Preceding 2018).

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 Impact Factor 2018-2019


The impact factor (IF) 2018 of 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 is 0.76, which is computed in 2019 as per it's definition. The impact factor (IF), also denoted as Journal impact factor (JIF), of an academic journal is a measure of the yearly average number of citations to recent articles published in that journal.



Table Setting

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 h-index


  Table Setting

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 has an h-index of 4. It means 4 articles of this conference and proceedings have more than 4 number of citations. The h-index is a way of measuring the productivity and citation impact of the publications. The h-index is defined as the maximum value of h such that the given journal/author has published h papers that have each been cited at least h number of times.

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 ISSN


The ISSN of 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 is 00002017. ISSN stands for International Standard Serial Number. An ISSN is a unique code of 8 digits. It is used for the recognition of journals, newspapers, periodicals, and magazines in all kind of forms, be it print-media or electronic.

Table Setting

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 Rank and SCImago Journal Rank (SJR)


The overall rank of 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 is 19875. According to SCImago Journal Rank (SJR), this conference and proceedings is ranked 0.169. SCImago Journal Rank is an indicator, which measures the scientific influence of journals. It considers the number of citations received by a journal and the importance of the journals from where these citations come.

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 Publisher


Table Setting

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 is published by . It's publishing house is located in United States. Coverage history of this conference and proceedings is as following: 2017. The organization or individual who handles the printing and distribution of printed or digital publications is known as Publisher.

How to publish in 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017


If your research field is/are related to Instrumentation; Management, Monitoring, Policy and Law; Signal Processing; Urban Studies, then you can visit the official website of the conference and proceedings.

Acceptance Rate


To check the acceptance rate of this conference and proceedings, visit here.

Call for Paper, Submission Guidelines, Notification Date, and Submission Deadline 2020/2019


Visit the official website of the journal/conference for the call for paper, submission guidelines, notification date, and submission deadlines.


Source: https://www.scimagojr.com/journalrank.php



Impact Factor, h-Index, and other important details of other Journals, Conferences, and Books


Journal/Conference/Workshop/Book Title Type Ranking Publisher h-index Impact Factor
Muttersprache journal 31380 Gesellschaft fur deutsche Sprache 6 0.05
International Urogynecology Journal and Pelvic Floor Dysfunction journal 5242 Springer Verlag 83 1.97
Indian Journal of Clinical Biochemistry journal 11326 Springer India 34 1.14
Journal of Child and Adolescent Psychopharmacology journal 4359 Mary Ann Liebert Inc. 77 2.38
Russian Chemical Bulletin journal 13490 Springer New York LLC 39 1.04
European Journal of International Management journal 8669 Inderscience Publishers 19 1.53
Zwingliana journal 27520 Theologischer Verlag Zurich 2 0.14
Freshwater Biology journal 1878 Blackwell Publishing Inc. 139 3.40
International Journal of Mental Health Nursing journal 6114 Blackwell Publishing Inc. 46 2.36
Annual Review of Food Science and Technology journal 914 Annual Reviews Inc. 51 8.62

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